Abstract: The invention relates to resin compositions that contains as components: (A) a monomer with at least one ethylenic unsaturation and with an isocyanate reactive group, (B) an ethylenically unsaturated monomer that can react with component (A) by means of radical polymerization, (C) a polyisocyanate that can react with component (A) by means of a polyurethane reaction and that on average has at least 1.75 isocyanate groups, (D) a catalyst for the radical polymerization, and that also contains (E) a thermoplastic polymer with an average molecular weight of at least 10,000 Dalton. The invention also relates to a process for the preparation of moulded articles from such resin compositions, as well as the moulded articles themselves.

Abstract: The invention relates to resin compositions that contains as components:

Abstract: The invention relates to a resin composition containing low-molecular compounds which form a polyester urethane hybrid network. The resin composition contains a first component consisting of a condensation product of at least one diol and at least one unsaturated dicarboxylic acid material, a second component containing an ethylenically unsaturated monomer capable of copolymerizing with the first component, and a third component consisting of a polyisocyanate. The first component substantially consists of a diester compound of 2 diol molecules and 1 molecule of a dicarboxylic acid material, which dicarboxylic acid material consists of at least 75% of .alpha.-, .beta.-unsaturated dicarboxylic acid.

Abstract: The present invention relates to a process for the manufacture of a cast, injection moulded or compression moulded articles by curing a resin composition in a desired shape using catalysts, and allowing the shaped piece to post-cure under such conditions that an HDT of at least 150.degree. C. is obtained. The resin composition comprises a polyisocyanate, an ethylenically unsaturated monomer and a vinyl ester compound, and the vinyl ester compound contains on average about two to about 6 (meth)acrylate groups and on average about two to about 6 hydroxyl groups, and has a molecular weight higher than 300. The invention also relates to a resin composition suitable for use in the process.

Abstract: Thermosetting compositions consist of a homogeneous mixture of an ethylenically unsaturated compound, a bismaleimide compound or a bismaleimide containing composition and an acid compound, with optionally further copolymerizable compounds and usual additives. The thermosetting composition are useful as a coating resin, a laminating resin or for the manufacture of shaped articles.

Abstract: The invention relates to a thermosetting composition comprisingA: 30-65 parts by weight of unsaturated polyester with a molar mass per double bond of 142-500B: 25-55 parts by weight of ethylenically unsaturated monomerC: 3-35 parts by weight of slightly ethylenically unsaturated polyesterD: 0-750 parts by weight of filler, fibrous material and, if so desired, other usual additives, characterized in that as as slight ethylenically unsaturated polyester an unsaturated polyester is used which has a molar mass per double bond of 1200-20,000 and an acid number of 5-50, and in which between 50 and 90% of the unsaturation consists of a terminal monoester of a .alpha., .beta.-unsaturated dicarboxylic acid. The composition presents little or no shrinkage in setting.

Abstract: The invention relates to a composition comprising(A) 64-4 parts by wt. of a bismaleimide compound, or an isomaleimide isomer thereof, a maleimide-amide compound or an isomaleimide isomer thereof and maleic anhydride compound,(B) 7-77 parts by wt. of one or more ethylenically unsaturated compounds containing 5-50 C-atoms and is characterized in that the composition further comprises(C) 3-60 parts by wt. of one or more compounds from the group of hydroxy-alkylacrylates or amino-alkylacrylates,(D) 1-20 parts by wt. of one or more terminally functional polymers as flexibilizer, with the proviso that the sum, of parts of compounds A, B, C and D amounts to 100.

Abstract: The invention relates to compositions containing 80-30 wt.-% of bismaleimide-compounds, 5-60 wt.-% maleimide-amide compounds and 1-10 wt.-% of a maleic an hydride derivative. The invention also relates to the preparation of such compositions as well as the homogeneous curable compositions, in a suitable solvent, comprising bismaleimide/maleimide-amide/maleic an hydride. The obtained copolymers show good chemical resistance and a high heat distortion temperature.

Abstract: The invention relates to compositions containing 80-30 weight % of bismaleimide-compounds, 5-60 weight % maleimide-amide compounds and 1-10 weight % maleic anhydride derivative. The invention further relates to the preparation of such compositions and to homogeneous curable compositions comprising bismaleimide/maleimide-amide/maleic anhydride compositions according to the invention. The obtained copolymers show good chemical resistance and a high heat distortion temperature.