Patents by Inventor Adrianus M. Lafort
Adrianus M. Lafort has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8526651Abstract: A receiver module configured to be seated within an ear canal and optimized for simultaneously inflating an inflatable membrane while generating acoustic waves transmitted to a user. The inflatable membrane can be used to secure the receiver module within the bony portion of the ear canal of the user. A multi-layer valve system and method of assembly are disclosed for a valve system to harvest static pressure from acoustic waves generated within the receiver and direct the increased pressure toward the inflatable membrane to inflate the membrane. The multi-layer valve system can be used to prevent a back flow of air and thereby maintain a static pressure differential between ambient air drawn in through an air ingress port and air forced into the inflatable membrane through an air egress port.Type: GrantFiled: January 24, 2011Date of Patent: September 3, 2013Assignee: Sonion Nederland BVInventors: Adrianus M. Lafort, Paul Christiaan van Hal
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Patent number: 8526652Abstract: A diaphonic valve utilizing the principle of the Synthetic Jet is disclosed herein. A diaphonic valve pump is provided for the inflation of an in-ear balloon. More complex embodiments of the present invention include stacks of multiple synthetic jets generating orifices as well as an oscillating, thin polymer membrane. In one or more embodiments of the present invention, a novel application is provided for the creation of static pressure to inflate or to deflate an inflatable member (balloon). In addition, sound can be utilized to inflate or deflate an inflatable member in a person's ear for the purpose of listening to sound.Type: GrantFiled: February 11, 2011Date of Patent: September 3, 2013Assignee: Sonion Nederland BVInventors: Stephen D. Ambrose, Samuel P. Gido, Robert B. Schulein, Paul Christiaan Van Hal, Adrianus M. Lafort
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Publication number: 20110311069Abstract: A diaphonic valve utilizing the principle of the Synthetic Jet is disclosed herein. A diaphonic valve pump is provided for the inflation of an in-ear balloon. More complex embodiments of the present invention include stacks of multiple synthetic jets generating orifices as well as an oscillating, thin polymer membrane. In one or more embodiments of the present invention, a novel application is provided for the creation of static pressure to inflate or to deflate an inflatable member (balloon). In addition, sound can be utilized to inflate or deflate an inflatable member in a person's ear for the purpose of listening to sound.Type: ApplicationFiled: February 11, 2011Publication date: December 22, 2011Applicant: Sonion Nederland BVInventors: Stephen D. Ambrose, Samuel P. Gido, Robert B. Schulein, Paul Christiaan van Hal, Adrianus M. Lafort
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Publication number: 20110182453Abstract: A receiver module configured to be seated within an ear canal and optimized for simultaneously inflating an inflatable membrane while generating acoustic waves transmitted to a user. The inflatable membrane can be used to secure the receiver module within the bony portion of the ear canal of the user. A multi-layer valve system and method of assembly are disclosed for a valve system to harvest static pressure from acoustic waves generated within the receiver and direct the increased pressure toward the inflatable membrane to inflate the membrane. The multi-layer valve system can be used to prevent a back flow of air and thereby maintain a static pressure differential between ambient air drawn in through an air ingress port and air forced into the inflatable membrane through an air egress port.Type: ApplicationFiled: January 24, 2011Publication date: July 28, 2011Applicant: Sonion Nederland BVInventors: PAUL CHRISTIAAN VAN HAL, ADRIANUS M. LAFORT
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Patent number: 7286680Abstract: A microphone includes a separate end cover with a sound port. A diaphragm is directly attached to the end cover. The backplate is positioned within the housing against a ridge near an end of the housing. A spacer is positioned against the backplate. The diaphragm engages the spacer when the end cover, with its attached diaphragm, is installed in the housing. The backplate of the microphone has an integral connecting wire that is made of the same material as the backplate. The integral connecting wire may have an inherent spring force to provide a pressure contact with the accompanying electrical components. The integral connecting wire electrically couples the backplate to the electronic components within the housing and transmits the raw audio signal corresponding to movement of the diaphragm. The housing may have first and second ridges on which the printed circuit board and the electret assembly are mounted, respectively.Type: GrantFiled: May 19, 2006Date of Patent: October 23, 2007Assignee: Sonion Nederland B.V.Inventors: Michael G. M. Steeman, Hendrik Dolleman, Paul C. van Hal, Adrianus M. Lafort, Jan Hijman, Dion I. de Roo, Auke P. Nauta, Raymond Mögelin
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Patent number: 7239714Abstract: In a microphone cartridge, a flexible printed circuit board serves two functions, separating the diaphragm and backplate, and electrically connecting the cartridge and the buffer amplifier. The flex-print includes a spacer portion that maintains the appropriate distance between the diaphragm and backplate, and an integral lead portion having a conductor serving as the signal path for transmitting the signal from the cartridge to the amplifier. The spacer portion has a conductor that electrically contacts the diaphragm or backplate and is connected to the conductor of the integral lead portion. The integral lead portion may optionally include a second electrical conductor providing a reference path from the cartridge to the amplifier. Further, the flex-print may be used as the carrier for the amplifier, its associated circuitry, and for other circuitry within the listening device.Type: GrantFiled: October 7, 2002Date of Patent: July 3, 2007Assignee: Sonion Nederland B.V.Inventors: Marcel de Blok, Adrianus M. Lafort, Dion I. de Roo
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Patent number: 7149317Abstract: A high impedance circuit includes a diode-connected MOSFET circuit. This circuit may be used in a buffer amplifier of a hearing aid microphone, coupled across an input of the buffer amplifier and providing a high input impedance.Type: GrantFiled: April 18, 2002Date of Patent: December 12, 2006Assignee: Sonionmicrotronic Nederland B.V.Inventor: Adrianus M. Lafort
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Patent number: 7062058Abstract: A microphone includes a separate end cover with a sound port. A diaphragm is directly attached to the end cover. The backplate is positioned within the housing against a ridge near an end of the housing. A spacer is positioned against the backplate. The diaphragm engages the spacer when the end cover, with its attached diaphragm, is installed in the housing. The backplate of the microphone has an integral connecting wire that is made of the same material as the backplate. The integral connecting wire may have an inherent spring force to provide a pressure contact with the accompanying electrical components. The integral connecting wire electrically couples the backplate to the electronic components within the housing and transmits the raw audio signal corresponding to movement of the diaphragm. The housing may have first and second ridges on which the printed circuit board and the electret assembly are mounted, respectively.Type: GrantFiled: April 17, 2002Date of Patent: June 13, 2006Assignee: Sonion Nederland B.V.Inventors: Michael G. M. Steeman, Hendrik Dolleman, Paul C. van Hal, Adrianus M. Lafort, Jan Hijman, Dion I. de Roo, Auke P. Nauta, Raymond Mögelin
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Patent number: 6937735Abstract: A microphone is constructed to be more tolerant to a wide range of relative humidity conditions without adversely affecting the performance of the microphone. The microphone includes a housing with a sound port for receiving sound and an electret assembly for converting the sound into an output signal. The electret assembly includes a diaphragm and a backplate. The backplate is made of at least two layers, usually polymeric layers. The first layer of material has a first hygroscopic coefficient and a second layer of material has a second hygroscopic coefficient. The first and second layers cause the backplate to bend in response to higher humidity conditions, thereby minimizing the adverse effects on microphone performance caused by characteristic changes in the diaphragm at the higher humidity conditions.Type: GrantFiled: August 1, 2002Date of Patent: August 30, 2005Assignee: SonionMicrotronic Néderland B.V.Inventors: Dion I. de Roo, Adrianus M. Lafort, Michel de Nooij, Raymond Mögelin
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Publication number: 20030199130Abstract: A high impedance circuit includes a diode-connected MOSFET circuit. This circuit may be used in a buffer amplifier of a hearing aid microphone, coupled across an input of the buffer amplifier and providing a high input impedance.Type: ApplicationFiled: April 18, 2002Publication date: October 23, 2003Inventor: Adrianus M. Lafort
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Publication number: 20030068059Abstract: In a microphone cartridge, a flexible printed circuit board serves two functions, separating the diaphragm and backplate, and electrically connecting the cartridge and the buffer amplifier. The flex-print includes a spacer portion that maintains the appropriate distance between the diaphragm and backplate, and an integral lead portion having a conductor serving as the signal path for transmitting the signal from the cartridge to the amplifier. The spacer portion has a conductor that electrically contacts the diaphragm or backplate and is connected to the conductor of the integral lead portion. The integral lead portion may optionally include a second electrical conductor providing a reference path from the cartridge to the amplifier. Further, the flex-print may be used as the carrier for the amplifier, its associated circuitry, and for other circuitry within the listening device.Type: ApplicationFiled: October 7, 2002Publication date: April 10, 2003Inventors: Marcel de Blok, Adrianus M. Lafort, Dion I. de Roo
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Publication number: 20030026444Abstract: A microphone is constructed to be more tolerant to a wide range of relative humidity conditions without adversely affecting the performance of the microphone. The microphone includes a housing with a sound port for receiving sound and an electret assembly for converting the sound into an output signal. The electret assembly includes a diaphragm and a backplate. The backplate is made of at least two layers, usually polymeric layers. The first layer of material has a first hygroscopic coefficient and a second layer of material has a second hygroscopic coefficient. The first and second layers cause the backplate to bend in response to higher humidity conditions, thereby minimizing the adverse effects on microphone performance caused by characteristic changes in the diaphragm at the higher humidity conditions.Type: ApplicationFiled: August 1, 2002Publication date: February 6, 2003Inventors: Dion I. de Roo, Adrianus M. Lafort, Michel de Nooij, Raymond Mogelin
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Publication number: 20020154790Abstract: A microphone includes a separate end cover with a sound port. A diaphragm is directly attached to the end cover. The backplate is positioned within the housing against a ridge near an end of the housing. A spacer is positioned against the backplate. The diaphragm engages the spacer when the end cover, with its attached diaphragm, is installed in the housing. The backplate of the microphone has an integral connecting wire that is made of the same material as the backplate. The integral connecting wire may have an inherent spring force to provide a pressure contact with the accompanying electrical components. The integral connecting wire electrically couples the backplate to the electronic components within the housing and transmits the raw audio signal corresponding to movement of the diaphragm. The housing may have first and second ridges on which the printed circuit board and the electret assembly are mounted, respectively.Type: ApplicationFiled: April 17, 2002Publication date: October 24, 2002Inventors: Michael G. M. Steeman, Hendrik Dolleman, Paul C. van Hal, Adrianus M. Lafort, Jan Hijman, Dion I. de Roo, Auke P. Nauta, Raymond Mogelin
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Patent number: 6353344Abstract: A high input impedance circuit for a buffer amplifier of a hearing aid microphone includes a transistor coupled across an input of the buffer amplifier and providing a high impedance transconductance, and a control circuit operatively coupled with the transistor to control the effective value of the input impedance provided thereby.Type: GrantFiled: May 22, 2000Date of Patent: March 5, 2002Assignee: Microtronic US, Inc.Inventor: Adrianus M. Lafort