Abstract: A semiconductor manufacturing apparatus includes an equipment front end module (EFEM) including a chamber having an inner space that accommodates a wafer container storing a plurality of wafers, the EFEM adjusting the inner space to first vacuum pressure or atmospheric pressure; and manufacturing process equipment configured to transfer a wafer in the wafer container to a process chamber that performs a manufacturing process of a wafer, and transfer a wafer, after the manufacturing process has been completed, in the process chamber to the wafer container.