Patents by Inventor Ae Yong Chung
Ae Yong Chung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7689876Abstract: A method and system for testing a semiconductor device is disclosed. The method provides an integrated test program defined by a plurality of test items, and a test program defined by a sub-set of the test items. Test data is derived by batch sample testing of the semiconductor device, and an error rate for a test item is computed and then compared to a reference data value. On the basis of the comparison between the error rate and the reference data value, the test program may be modified in real-time.Type: GrantFiled: April 4, 2007Date of Patent: March 30, 2010Assignee: Samsung Electronics Co., Ltd.Inventors: Ae-yong Chung, Hwa-cheol Lee, Se-rae Cho, Kyeong-seon Shin
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Patent number: 7633288Abstract: Example embodiments may provide a method of testing semiconductor devices by identifying units of lots and a test tray such that a plurality of lots having semiconductor devices may be continuously tested by a handler. Example embodiments may also provide a handler used to test the semiconductor devices.Type: GrantFiled: September 27, 2006Date of Patent: December 15, 2009Assignee: Samsung Electronics Co., Ltd.Inventors: Ae-Yong Chung, Eun-Seok Lee, Ki-Sang Kang, Kyeong-Seon Shin
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Patent number: 7602172Abstract: A test apparatus includes one handler connected to a tester and one test board divided into two or more sites or two or more test boards. Since only the sites on the test board (or test boards) need be duplicated, rather than the loading lanes or sorters of the handler, the test apparatus can be conveniently compact. Further, while testing semiconductor devices on one site or one test board, semiconductor devices in another site or on another test board can be sorted according to the test result. This enables the reduction or elimination of tester idle time to optimize the efficiency of the test apparatus.Type: GrantFiled: April 24, 2008Date of Patent: October 13, 2009Assignee: Samsung Electronics Co., Ltd.Inventors: Ae-Yong Chung, Sung-Ok Kim, Kyeong-Seon Shin, Jeong-Ho Bang
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Publication number: 20090140761Abstract: A method of testing a semiconductor device, which can reduce a period of time for testing a packaged semiconductor chip. First, semiconductor chips to be tested are classified in a lot unit. The semiconductor chips are fist tested in units of lots. The defective semiconductor chips among the semiconductor chips of a predetermined number of lots that are first time tested are collectively retested. First test data regarding the semiconductor chips may be classified and stored for each respective lot. Retest data regarding the semiconductor chips may be classified and stored for each respective lot. Test data regarding the semiconductor chips may be classified and stored into first test data and retest data for each respective lot.Type: ApplicationFiled: October 22, 2008Publication date: June 4, 2009Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Sung-Ok KIM, Ae-Yong CHUNG, Se-Rae CHO, Chul-Min LEE, Eun-Seok LEE
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Publication number: 20080197874Abstract: A test apparatus includes one handler connected to a tester and one test board divided into two or more sites or two or more test boards. Since only the sites on the test board (or test boards) need be duplicated, rather than the loading lanes or sorters of the handler, the test apparatus can be conveniently compact. Further, while testing semiconductor devices on one site or one test board, semiconductor devices in another site or on another test board can be sorted according to the test result. This enables the reduction or elimination of tester idle time to optimize the efficiency of the test apparatus.Type: ApplicationFiled: April 24, 2008Publication date: August 21, 2008Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Ae-Yong CHUNG, Sung-Ok KIM, Kyeong-Seon SHIN, Jeong-Ho BANG
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Test system of semiconductor device having a handler remote control and method of operating the same
Patent number: 7408339Abstract: A test system of a semiconductor device for a handler remote control is provided. The system includes: a tester for testing the semiconductor device; a handler connected to the tester through a GPIB (General Purpose Instruction Bus) communication cable; a tester server connected to the tester to download a test program, handler remote control program and a handler state check program to the tester; and communication data transmitted and received through the GPIB communication cable between the tester and the handler, wherein the communication data has basic communication data for an electrical test of the semiconductor device, communication data for the handler remote control, and communication data for a handler state check.Type: GrantFiled: May 15, 2007Date of Patent: August 5, 2008Assignee: Samsung Electronics Co., Ltd.Inventors: Ae-Yong Chung, Eun-Seok Lee, Jeong-Ho Bang, Kyeong-Seon Shin, Dae-Gab Chi, Sung-Ok Kim -
Patent number: 7378864Abstract: A test apparatus includes one handler connected to a tester and one test board divided into two or more sites or two or more test boards. Since only the sites on the test board (or test boards) need be duplicated, rather than the loading lanes or sorters of the handler, the test apparatus can be conveniently compact. Further, while testing semiconductor devices on one site or one test board, semiconductor devices in another site or on another test board can be sorted according to the test result. This enables the reduction or elimination of tester idle time to optimize the efficiency of the test apparatus.Type: GrantFiled: March 28, 2005Date of Patent: May 27, 2008Assignee: Samsung Electronics Co., Ltd.Inventors: Ae-Yong Chung, Sung-Ok Kim, Kyeong-Seon Shin, Jeong-Ho Bang
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Publication number: 20080022167Abstract: A method and system for testing a semiconductor device is disclosed. The method provides an integrated test program defined by a plurality of test items, and a test program defined by a sub-set of the test items. Test data is derived by batch sample testing of the semiconductor device, and an error rate for a test item is computed and then compared to a reference data value. On the basis of the comparison between the error rate and the reference data value, the test program may be modified in real-time.Type: ApplicationFiled: April 4, 2007Publication date: January 24, 2008Inventors: Ae-yong Chung, Hwa-cheol Lee, Se-rae Cho, Kyeong-seon Shin
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TEST SYSTEM OF SEMICONDUCTOR DEVICE HAVING A HANDLER REMOTE CONTROL AND METHOD OF OPERATING THE SAME
Publication number: 20070290707Abstract: A test system of a semiconductor device for a handler remote control is provided. The system includes: a tester for testing the semiconductor device; a handler connected to the tester through a GPIB (General Purpose Instruction Bus) communication cable; a tester server connected to the tester to download a test program, handler remote control program and a handler state check program to the tester; and communication data transmitted and received through the GPIB communication cable between the tester and the handler, wherein the communication data has basic communication data for an electrical test of the semiconductor device, communication data for the handler remote control, and communication data for a handler state check.Type: ApplicationFiled: May 15, 2007Publication date: December 20, 2007Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Ae-Yong CHUNG, Eun-Seok LEE, Jeong-Ho BANG, Kyeong-Seon SHIN, Dae-Gab CHI, Sung-Ok KIM -
Test system of semiconductor device having a handler remote control and method of operating the same
Patent number: 7230417Abstract: A test system of a semiconductor device for a handler remote control is provided. The system includes: a tester for testing the semiconductor device; a handler connected to the tester through a GPIB (General Purpose Instruction Bus) communication cable; a tester server connected to the tester to download a test program, handler remote control program and a handler state check program to the tester; and communication data transmitted and received through the GPIB communication cable between the tester and the handler, wherein the communication data has basic communication data for an electrical test of the semiconductor device, communication data for the handler remote control, and communication data for a handler state check.Type: GrantFiled: October 17, 2005Date of Patent: June 12, 2007Assignee: Samsung Electronics Co., Ltd.Inventors: Ae-Yong Chung, Eun-Seok Lee, Jeong-Ho Bang, Kyeong-Seon Shin, Dae-Gab Chi, Sung-Ok Kim -
Publication number: 20070075719Abstract: Example embodiments may provide a method of testing semiconductor devices by identifying units of lots and a test tray such that a plurality of lots having semiconductor devices may be continuously tested by a handler. Example embodiments may also provide a handler used to test the semiconductor devices.Type: ApplicationFiled: September 27, 2006Publication date: April 5, 2007Inventors: Ae-Yong Chung, Eun-Seok Lee, Ki-Sang Kang, Kyeong-Seon Shin
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Test system of semiconductor device having a handler remote control and method of operating the same
Publication number: 20060158211Abstract: A test system of a semiconductor device for a handler remote control is provided. The system includes: a tester for testing the semiconductor device; a handler connected to the tester through a GPIB (General Purpose Instruction Bus) communication cable; a tester server connected to the tester to download a test program, handler remote control program and a handler state check program to the tester; and communication data transmitted and received through the GPIB communication cable between the tester and the handler, wherein the communication data has basic communication data for an electrical test of the semiconductor device, communication data for the handler remote control, and communication data for a handler state check.Type: ApplicationFiled: October 17, 2005Publication date: July 20, 2006Inventors: Ae-Yong Chung, Eun-Seok Lee, Jeong-Ho Bang, Kyeong-Seon Shin, Dae-Gab Chi, Sung-Ok Kim -
Patent number: 6960908Abstract: An electrical testing method for a semiconductor package for detecting defects of sockets mounted on a device under test (DUT) board is provided. A tester performs electrical test, accumulates electrical test results, and compares the accumulated results to reference values. The result of the comparison decides whether a plurality of sockets mounted on the DUT board can be used or not. The decision results are transmitted to a handler so that the socket having the defects is not used on the DUT board.Type: GrantFiled: April 13, 2004Date of Patent: November 1, 2005Assignee: Samsung Electronics Co., Ltd.Inventors: Ae-yong Chung, Sung-Ok Kim, Jeong-ho Bang, Kyeong-seon Shin, Dae-gab Chi
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Publication number: 20050168236Abstract: A test apparatus includes one handler connected to a tester and one test board divided into two or more sites or two or more test boards. Since only the sites on the test board (or test boards) need be duplicated, rather than the loading lanes or sorters of the handler, the test apparatus can be conveniently compact. Further, while testing semiconductor devices on one site or one test board, semiconductor devices in another site or on another test board can be sorted according to the test result. This enables the reduction or elimination of tester idle time to optimize the efficiency of the test apparatus.Type: ApplicationFiled: March 28, 2005Publication date: August 4, 2005Applicant: Samsung Electronics Co., Ltd.Inventors: Ae-Yong Chung, Sung-Ok Kim, Kyeong-Seon Shin, Jeong-Ho Bang
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Patent number: 6922050Abstract: A method for testing semiconductor devices includes loading a customer tray with semiconductor devices to be tested. Groups of devices are transferred from the customer tray to buffer trays for testing. The number of devices in the customer tray is checked after each transfer. If the customer tray is empty, the number of semiconductor devices in the buffer trays is counted and compared with the number of semiconductor devices that can be tested simultaneously, typically either 64 or 128. If the number of semiconductor devices in the buffer trays is greater than the tester capacity, the semiconductor devices in at least one buffer tray are tested. If the number of semiconductor devices in the buffer trays is smaller than the tester capacity, semiconductor devices that were determined to be low quality in a prior test are loaded into a buffer tray, thus testing both untested and low quality devices together.Type: GrantFiled: April 28, 2004Date of Patent: July 26, 2005Assignee: Samsung Electronics Co., Ltd.Inventors: Ae-yong Chung, Sung-ok Kim, Jeong-ho Bang, Kyeong-seon Shin, Dae-gab Chi
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Patent number: 6903567Abstract: A test apparatus includes one handler connected to a tester and one test board divided into two or more sites or two or more test boards. Since only the sites on the test board (or test boards) need be duplicated, rather than the loading lanes or sorters of the handler, the test apparatus can be conveniently compact. Further, while testing semiconductor devices on one site or one test board, semiconductor devices in another site or on another test board can be sorted according to the test result. This enables the reduction or elimination of tester idle time to optimize the efficiency of the test apparatus.Type: GrantFiled: September 25, 2003Date of Patent: June 7, 2005Assignee: Samsung Electronics Co., Ltd.Inventors: Ae-Yong Chung, Sung-Ok Kim, Kyeong-Seon Shin, Jeong-Ho Bang
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Patent number: 6857090Abstract: A system and method automatically analyzes and manages loss factor data of test processes in which a great number of IC devices are tested as a lot with a number of testers. The lot contains a predetermined number of identical IC devices, and the lot test process is performed sequentially according to a predetermined number of test cycles. The system include a means for verifying test results for each of the test cycles and for determining whether or not a re-test is to be performed and an IC device loading/unloading means for loading IC devices to be tested and contained in the lot to a test head and for unloading the tested IC devices from the test head by sorting the tested IC devices according to the test results.Type: GrantFiled: October 9, 2001Date of Patent: February 15, 2005Assignee: Samsung Electronics Co., Ltd.Inventors: Kyu Sung Lee, Ae Yong Chung, Sung Ok Kim
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Publication number: 20040253753Abstract: A method for testing semiconductor devices includes loading a customer tray with semiconductor devices to be tested in a loader. The devices are moved from the customer tray into a test tray via a buffer tray of a loader buffer. The tested semiconductor devices are classified into high and low quality semiconductor devices. The classified semiconductor devices are unloaded from the test tray to the customer tray of an unloader via an unloader buffer. If the customer tray is not empty, the semiconductor devices are tested. If the customer tray is empty, the number of semiconductor devices in the buffer tray buffer is counted and compared with the number of semiconductor devices that can be tested simultaneously, typically either 64 or 128. If the number of semiconductor devices in the buffer tray is greater than the tester capacity, the semiconductor devices in the buffer tray are tested.Type: ApplicationFiled: April 28, 2004Publication date: December 16, 2004Applicant: Samsung Electronics Co., Ltd.Inventors: Ae-yong Chung, Sung-ok Kim, Jeong-ho Bang, Kyeong-seon Shin, Dae-gab Chi
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Publication number: 20040207387Abstract: An electrical testing method for a semiconductor package for detecting defects of sockets mounted on a device under test (DUT) board is provided. A tester performs electrical test, accumulates electrical test results, and compares the accumulated results to reference values. The result of the comparison decides whether a plurality of sockets mounted on the DUT board can be used or not. The decision results are transmitted to a handler so that the socket having the defects is not used on the DUT board.Type: ApplicationFiled: April 13, 2004Publication date: October 21, 2004Inventors: Ae-yong Chung, Sung-Ok Kim, Jeong-ho Bang, Kyeong-seon Shin, Dae-gab Chi
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Publication number: 20040061491Abstract: A test apparatus includes one handler connected to a tester and one test board divided into two or more sites or two or more test boards. Since only the sites on the test board (or test boards) need be duplicated, rather than the loading lanes or sorters of the handler, the test apparatus can be conveniently compact. Further, while testing semiconductor devices on one site or one test board, semiconductor devices in another site or on another test board can be sorted according to the test result. This enables the reduction or elimination of tester idle time to optimize the efficiency of the test apparatus.Type: ApplicationFiled: September 25, 2003Publication date: April 1, 2004Inventors: Ae-Yong Chung, Sung-Ok Kim, Kyeong-Seon Shin, Jeong-Ho Bang