Patents by Inventor Aerik WEI

Aerik WEI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Fiber optic adapter
    Patent number: 11609385
    Abstract: A fiber optic adapter includes: an outer casing that has a plurality of connecting holes, a plurality of installation slots disposed in front of and spatially communicated with the connecting holes, and a plurality of insertion slots disposed behind and spatially communicated with the connecting holes; a position-limiting member that is fixed to the outer casing, and that includes a main plate portion, two side plate portions, a plurality of resilient plate portions disposed obliquely on the main and side plate portions, and a plurality of protruding portions protruding from the main and side plate portions; and a plurality of mounting seats that are inserted removably into the installation slots.
    Type: Grant
    Filed: September 27, 2021
    Date of Patent: March 21, 2023
    Assignee: AMPHENOL FIBER OPTIC TECHNOLGY (SHENZHEN) CO., LTD.
    Inventor: Aerik Wei
  • FIBER OPTIC ADAPTER
    Publication number: 20230008599
    Abstract: A fiber optic adapter includes: an outer casing that has a plurality of connecting holes, a plurality of installation slots disposed in front of and spatially communicated with the connecting holes, and a plurality of insertion slots disposed behind and spatially communicated with the connecting holes; a position-limiting member that is fixed to the outer casing, and that includes a main plate portion, two side plate portions, a plurality of resilient plate portions disposed obliquely on the main and side plate portions, and a plurality of protruding portions protruding from the main and side plate portions; and a plurality of mounting seats that are inserted removably into the installation slots.
    Type: Application
    Filed: September 27, 2021
    Publication date: January 12, 2023
    Inventor: Aerik WEI