Abstract: Thermosetting resin compositions useful for liquid compression molding encapsulation of a silicon wafer are provided. The so-encapsulated silicon wafers offer improved resistance to warpage, compared to unencapsulated wafers or wafers encapsulated with known encapsulation materials.

Abstract: This invention relates to thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as CSPs, BGAs, LGAs and the like, each of which having a semiconductor chip, such as LSI, on a carrier substrate. The compositions of this invention are reworkable when subjected to appropriate conditions.

Abstract: This invention relates to thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as CSPs, BGAs, LGAs and the like, each of which having a semiconductor chip, such as LSI, on a carrier substrate. The compositions of this invention are reworkable when subjected to appropriate conditions.

Abstract: This invention relates to thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”), and the like, each of which having a semiconductor chip, such as large scale integration (“LSI”), on a carrier substrate, as well as compounds useful in such compositions. The compositions include compounds having a thermally cleavable linkage, and include an episulfide group within the compound. The compositions of this invention are reworkable when subjected to appropriate conditions.

Abstract: A flip-chip type integrated circuit chip including a chip die having electrical contacts arranged in a predetermined pattern and capable of providing electrical interconnection with a carrier substrate is provided. The chip die includes a fluxing agent disposed on a surface of the electrical contacts, and a curable thermosetting underfill composition distinct from the fluxing agent and disposed in a flowable form over the chip die. Upon mating of the chip die with the substrate and heating, the electrical contacts flow and the thermosetting underfill composition cures, thus adhering the chip die to the substrate, forming a circuit assembly.

Abstract: This invention relates to thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as CSPs, BGAs, LGAs and the like, each of which having a semiconductor chip, such as LSI, on a carrier substrate. The compositions of this invention are reworkable when subjected to appropriate conditions.

Abstract: This invention relates to thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as CSPs, BGAs, LGAs and the like, each of which having a semiconductor chip, such as LSI, on a carrier substrate. The compositions of this invention are reworkable when subjected to appropriate conditions.

Abstract: This invention relates to epoxidized acetals and thioacetals, episulfidized acetals and thioacetals, thermosetting resin compositions based on such epoxidized acetals and thioacetals, episulfidized acetals and thioacetals, reaction products of which are controllably degradable when subjected to appropriate conditions.

Abstract: This invention relates to thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as CSPs, BGAs, LGAs and the like, each of which having a semiconductor chip, such as LSI, on a carrier substrate. The compositions of this invention are reworkable when subjected to appropriate conditions.

Abstract: A method of removing an electronic component from a substrate to which it is electrically interconnected through softening of a cured resin composition is disclosed. The method involves applying infrared radiation directly to the electronic component such that radiant energy transfers through the electronic component to the resin composition, to cause the resin composition to soften. The radiant energy may be transferred directly through the electronic component, such as when the electronic component is at least partially transparent to infrared radiation. Also, the radiant energy may be transferred indirectly, with the electronic component at least partially absorbing the infrared radiation, causing an increase in temperature of the electronic component, which in turn causes an increase in temperature of the resin composition. After the resin composition is softened, it is removed from the substrate.

Abstract: A flip-chip type integrated circuit chip including a chip die having electrical contacts arranged in a predetermined pattern and capable of providing electrical interconnection with a carrier substrate is provided. The chip die includes a fluxing agent disposed on a surface of the electrical contacts, and a curable thermosetting underfill composition distinct from the fluxing agent and disposed in a flowable form over the chip die. Upon mating of the chip die with the substrate and heating, the electrical contacts flow and the thermosetting underfill composition cures, thus adhering the chip die to the substrate, forming a circuit assembly.

Abstract: A method for monitoring the properties of a coating comprising the steps of adding a fluorescence probe to a coating composition which has the ability to undergo microscopic changes in viscosity, the ratio of the intensity of the fluorescence emission of said probe at two wavelengths changing in response to said changes in said viscosity of said coating composition; curing said coating; causing said compound to fluoresce; measuring the fluorescence of said compound; calculating the ratio of the intensities of fluorescence emission of said compound at two or more wavelengths; relating said ratio to the monitored property of said coating.

Abstract: A method for monitoring a property of a polymeric mass such as a coating or film comprising the steps of adding a fluorescence probe compound capable of fluorescing to a polymeric composition which has the ability to undergo changes in microviscosity, the ratio of the intensity of the fluorescence emission of said compound at two wavelengths changing in response to said changes in said microviscosity of said composition; curing said composition; causing said compound to fluoresce; measuring the fluorescence of said compound; calculating the ratio of the intensities of fluorescence emission of said compound at two or more wavelengths; relating said ratio to the monitored property of said composition.