Abstract: A branched polyorganosiloxane having, on average, at least two radical-curable groups per molecule and a curable silicone composition that comprises (I) the branched polyorganosiloxane and (II) a radical initiator. Cured products prepared therefrom. Devices containing the branched polyorganosiloxane, composition, or cured product. Methods of making the branched polyorganosiloxane and composition and methods of using and uses of the materials and devices.

Abstract: A moisture-curable silicone adhesive composition is provided that comprises (A) a reactive resin, (B) a reactive polymer, (C) a moisture cure catalyst, and (D) a crosslinker resin. The reactive resin (A) comprises the reaction product of a reaction of an alkenyl-functional siloxane resin comprising R3SiO1/2 units and SiO4/2 units and an alkoxysilane-functional organosiloxane compound having at least one silicon-bonded hydrogen atom in the presence of a hydrosilylation catalyst. The reactive polymer (B) comprises the reaction product of a reaction of an alkoxysilane-functional organosiloxane compound having at least one silicon-bonded hydrogen atom and a polyorganosiloxane having an average, per molecule, of at least 2 aliphatically unsaturated organic groups in the presence of a hydrosilylation catalyst.

Abstract: A hydrosilylation process is used to prepare a clustered functional polyorganosiloxane. The clustered functional polyorganosiloxane comprises a reaction product of a reaction of a) a polyorganosiloxane having an average, per molecule, of at least 2 aliphatically unsaturated organic groups; b) a polyorganohydrogensiloxane having an average of 4 to 15 silicon atoms per molecule; and c) a reactive species having, per molecule at least 1 aliphatically unsaturated organic group and 1 or more radical curable groups selected from an acrylate group and a methacrylate group; in the presence of d) a hydrosilylation catalyst, and e) an isomer reducing agent. The weight percent of silicon bonded hydrogen atoms in component b) divided by the weight percent of aliphatically unsaturated organic groups in component a) (the SiHb/Via ratio) ranges from 4/1 to 20/1. The resulting clustered functional polyorganosiloxane is useful in a curable silicone composition for electronics applications.

Abstract: An alkoxy-functional organopolysiloxane resin and polymer is disclosed that comprises the reaction product of a reaction of (i) an alkenyl-functional siloxane resin comprising R3SiO1/2 units and SiO4/2 units; (ii) an alkoxysilane-functional organosiloxane compound having at least one silicon-bonded hydrogen atom at a molecular terminal; (iii) an endcapper according to the formula to the formula R23Si—(R22SiO)s—SiR22H or R23Si—(R22SiO)t—(HR2SiO)—SiR23, or combinations thereof; and (iv) a polyorganosiloxane having an average, per molecule, of at least 2 aliphatically unsaturated organic groups in the presence of a (v) hydrosilylation catalyst. In this alkoxy-functional organopolysiloxane resin and polymer, each R2 is independently a hydrocarbon radical and the subscripts s and t independently have values ranging from 0 to 10.

Abstract: An opto-physical material comprises a curable matrix composition and an effective amount of an ultraviolet light additive dispersed therein. The opto-physical material has a refractive index ranging from 1 to 1.8 at 589 nm wavelength and a light transmission value of 30% or less at any wavelength in the ultraviolet light spectrum. In addition, a test value of an optical physical property for the opto-physical material does not differ by more than 5% from a predetermined value of the optical physical property when the predetermined value is measured under the same measurement conditions for an opto-physical material comprising a comparative curable matrix composition lacking the ultraviolet light additive, wherein the optical physical property is selected from color shift in the visible light spectrum, light diffusivity at any wavelength in the light spectrum, light transmission in the visible light spectrum, and combinations thereof.

Abstract: A curable silicone composition is provided that comprises a reaction product of a reaction of (I) a clustered functional polyorganopolysiloxane having at least one radical curable group selected from an acrylate group and a methacrylate group; (II) a silicone reactive diluent, and a (III) a radical initiator.

Abstract: A stable thermal radical curable silicone composition is provided that comprises (I) a clustered functional polyorganopolysiloxane having one or more radical curable groups selected from an acrylate group and a methacrylate group; (II) a reactive resin and polymer; (III) a radical initiator; (IV) a moisture cure initiator; and (V) a crosslinker. The reactive resin and polymer includes (a) an organopolysiloxane polymer and (b) an alkoxy-functional organopolysiloxane resin. The alkoxy-functional organopolysiloxane resin comprises the reaction product of a reaction of (i) an alkenyl-functional siloxane resin, (ii) an alkoxysilane-functional organosiloxane, and (iii) an endcapper in the presence of (iv) hydrosilylation catalyst. The stable thermal radical curable silicone composition can be utilized for electronics applications.

Abstract: A branched polyorganosiloxane having, on average, at least two radical-curable groups per molecule and a curable silicone composition that comprises (I) the branched polyorganosiloxane and (II) a radical initiator. Cured products prepared therefrom. Devices containing the branched polyorganosiloxane, composition, or cured product. Methods of making the branched polyorganosiloxane and composition and methods of using and uses of the materials and devices.

Abstract: An in situ method for forming a thermally conductive thermal radical cure silicone composition is provided. The in situ method comprises forming a thermally conductive clustered functional polymer comprising the reaction product of a reaction of a polyorganosiloxane having an average, per molecule, of at least 2 aliphatically unsaturated organic groups; a polyorganohydrogensiloxane having an average of 4 to 15 silicon atoms per molecule; and a reactive species having, per molecule, at least 1 aliphatically unsaturated organic group and 1 or more curable groups; in the presence of a filler treating agent, a filler comprising a thermally conductive filler, an isomer reducing agent, and a hydrosilylation catalyst. The method further comprises blending the thermally conductive clustered functional polymer with a radical initiator.

Abstract: A curable silicone composition is provided that comprises a reaction product of a reaction of (I) a clustered functional polyorganopolysiloxane having at least one radical curable group selected from an acrylate group and a methacrylate group; (II) a silicone reactive diluent, and a (III) a radical initiator.

Abstract: A hydrosilylation process is used to prepare a clustered functional polyorganosiloxane. The clustered functional polyorganosiloxane comprises a reaction product of a reaction of a) a polyorganosiloxane having an average, per molecule, of at least 2 ahphatically unsaturated organic groups; b) a polyorganohydrogensiloxane having an average of 4 to 15 silicon atoms per molecule; and c) a reactive species having, per molecule at least 1 aliphatically unsaturated organic group and 1 or more radical curable groups selected from an acrylate group and a methacrylate group; in the presence of d) a hydrosilylation catalyst, and e) an isomer reducing agent. The weight percent of silicon bonded hydrogen atoms in component b) divided by the weight percent of aliphatically unsaturated organic groups in component a) (the SiHb/Via ratio) ranges from 4/1 to 20/1. The resulting clustered functional polyorganosiloxane is useful in a curable silicone composition for electronics applications.

Abstract: An alkoxy-functional organopolysiloxane resin and polymer is disclosed that comprises the reaction product of a reaction of (i) an alkenyl-functional siloxane resin comprising R3SiO1/2 units and SiO4/2 units; (ii) an alkoxysilane-functional organosiloxane compound having at least one silicon-bonded hydrogen atom at a molecular terminal; (iii) an endcapper according to the formula to the formula R23Si—(R22SiO)s—SiR22H or R23Si—(R22SiO)t—(HR2SiO)—SiR23, or combinations thereof; and (iv) a polyorganosiloxane having an average, per molecule, of at least 2 aliphatically unsaturated organic groups in the presence of a (v) hydrosilylation catalyst. In this alkoxy-functional organopolysiloxane resin and polymer, each R2 is independently a hydrocarbon radical and the subscripts s and t independently have values ranging from 0 to 10.

Abstract: A moisture-curable silicone adhesive composition is provided that comprises (A) a reactive resin, (B) a reactive polymer, (C) a moisture cure catalyst, and (D) a crosslinker resin. The reactive resin (A) comprises the reaction product of a reaction of an alkenyl-functional siloxane resin comprising R3SiO1/2 units and SiO4/2 units and an alkoxysilane-functional organosiloxane compound having at least one silicon-bonded hydrogen atom in the presence of a hydrosilylation catalyst. The reactive polymer (B) comprises the reaction product of a reaction of an alkoxysilane-functional organosiloxane compound having at least one silicon-bonded hydrogen atom and a polyorganosiloxane having an average, per molecule, of at least 2 aliphatically unsaturated organic groups in the presence of a hydrosilylation catalyst.

Abstract: A stable thermal radical curable silicone composition is provided that comprises (I) a clustered functional polyorganopolysiloxane having one or more radical curable groups selected from an acrylate group and a methacrylate group; (II) a reactive resin and polymer; (III) a radical initiator; (IV) a moisture cure initiator; and (V) a crosslinker. The reactive resin and polymer includes (a) an organopolysiloxane polymer and (b) an alkoxy-functional organopolysiloxane resin. The alkoxy-functional organopolysiloxane resin comprises the reaction product of a reaction of (i) an alkenyl-functional siloxane resin, (ii) an alkoxysilane-functional organosiloxane, and (iii) an endcapper in the presence of (iv) hydrosilylation catalyst. The stable thermal radical curable silicone composition can be utilized for electronics applications.

Abstract: An in situ method for forming a thermally conductive thermal radical cure silicone composition is provided. The in situ method comprises forming a thermally conductive clustered functional polymer comprising the reaction product of a reaction of a polyorganosiloxane having an average, per molecule, of at least 2 aliphatically unsaturated organic groups; a polyorganohydrogensiloxane having an average of 4 to 15 silicon atoms per molecule; and a reactive species having, per molecule, at least 1 aliphatically unsaturated organic group and 1 or more curable groups; in the presence of a filler treating agent, a filler comprising a thermally conductive filler, an isomer reducing agent, and a hydrosilylation catalyst. The method further comprises blending the thermally conductive clustered functional polymer with a radical initiator.

Abstract: A curable silicone composition includes (A) a polydiorganosiloxane having an average, per molecule, of at least two aliphatically unsaturated organic groups and at least one aromatic group; (B) a branched polyorganosiloxane having an average, per molecule, of at least one aliphatically unsaturated organic group and at least one aromatic group; (C) a polyorganohydrogensiloxane having an average per molecule of at least two silicon-bonded hydrogen atoms and at least one aromatic group, (D) a hydrosilylation catalyst, and (E) a silylated acetylenic inhibitor. The curable silicone composition cures to form a cured silicone resin having a refractive index >1.40. The curable silicone composition cures by heating to form a cured silicone resin with an optical transparency >95% at a thickness of 2.0 mm or less at 400 nm wavelength after thermal aging by heating at 200° C. for 14 days.