Patents by Inventor Agnes Baffert

Agnes Baffert has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Encapsulation cover for an electronic package and fabrication process
    Patent number: 11437527
    Abstract: An encapsulation cover for an electronic package includes a frontal wall with a through-passage extending between faces. The frontal wall includes an optical element that allows light to pass through the through-passage. A cover body and a metal insert that is embedded in the cover body, with the cover body being overmolded over the metal insert, defines at least part of the frontal wall.
    Type: Grant
    Filed: June 9, 2020
    Date of Patent: September 6, 2022
    Assignee: STMicroelectronics (Grenoble 2) SAS
    Inventors: Karine Saxod, Veronique Ferre, Agnes Baffert, Jean-Michel Riviere
  • ENCAPSULATION COVER FOR AN ELECTRONIC PACKAGE AND FABRICATION PROCESS
    Publication number: 20220029034
    Abstract: An encapsulation cover for an electronic package includes a frontal wall with a through-passage extending between faces. The frontal wall includes an optical element that allows light to pass through the through-passage. A cover body and a metal insert that is embedded in the cover body, with the cover body being overmolded over the metal insert, defines at least part of the frontal wall.
    Type: Application
    Filed: October 6, 2021
    Publication date: January 27, 2022
    Applicant: STMicroelectronics (Grenoble 2) SAS
    Inventors: Karine SAXOD, Veronique FERRE, Agnes BAFFERT, Jean-Michel RIVIERE
  • ENCAPSULATION COVER FOR AN ELECTRONIC PACKAGE AND FABRICATION PROCESS
    Publication number: 20200303565
    Abstract: An encapsulation cover for an electronic package includes a frontal wall with a through-passage extending between faces. The frontal wall includes an optical element that allows light to pass through the through-passage. A cover body and a metal insert that is embedded in the cover body, with the cover body being overmolded over the metal insert, defines at least part of the frontal wall.
    Type: Application
    Filed: June 9, 2020
    Publication date: September 24, 2020
    Applicant: STMicroelectronics (Grenoble 2) SAS
    Inventors: Karine SAXOD, Veronique FERRE, Agnes BAFFERT, Jean-Michel RIVIERE
  • ENCAPSULATION COVER FOR AN ELECTRONIC PACKAGE AND FABRICATION PROCESS
    Publication number: 20190157469
    Abstract: An encapsulation cover for an electronic package includes a frontal wall with a through-passage extending between faces. The frontal wall includes an optical element that allows light to pass through the through-passage. A cover body and a metal insert that is embedded in the cover body, with the cover body being overmolded over the metal insert, defines at least part of the frontal wall.
    Type: Application
    Filed: November 15, 2018
    Publication date: May 23, 2019
    Applicant: STMicroelectronics (Grenoble 2) SAS
    Inventors: Karine SAXOD, Veronique FERRE, Agnes BAFFERT, Jean-Michel RIVIERE
  • ELECTRONIC DEVICE EQUIPPED WITH A HEAT SINK
    Publication number: 20170127567
    Abstract: An electronic device includes a support plate with an integrated circuit chip fixed onto the support plate. A heat sink is mounted to the support plate. An electrical connection wire is provided with one end electrically connected to the heat sink and another end electrically connected to an electrical contact provided on the support plate.
    Type: Application
    Filed: April 18, 2016
    Publication date: May 4, 2017
    Applicant: STMicroelectronics (Grenoble 2) SAS
    Inventors: Benoit Besancon, Agnes Baffert, Karine Saxod