Patents by Inventor Agnes Padovani

Agnes Padovani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Light transparent substrate imprint tool with light blocking distal end
    Publication number: 20050227497
    Abstract: A substrate imprint tool is provided with a light transparent base and a light blocking distal end that is coupled to the light transparent base.
    Type: Application
    Filed: March 19, 2004
    Publication date: October 13, 2005
    Inventor: Agnes Padovani
  • Optical waveguides formed from nano air-gap inter-layer dielectric materials and methods of fabrication thereof
    Patent number: 6947651
    Abstract: Waveguides and methods of fabrication thereof are presented. A representative waveguide includes a waveguide core and a cladding layer, where the cladding layer surrounds the waveguide core. The waveguide core and cladding can be made of a host material having a plurality of nano-pores, wherein the nano-pores include a sacrificial material, and the sacrificial material can be selectively decomposed in both the core and cladding layers to form a plurality of nano air-gaps.
    Type: Grant
    Filed: May 10, 2002
    Date of Patent: September 20, 2005
    Assignee: Georgia Tech Research Corporation
    Inventors: Tony Mule′ , Paul Kohl, James D. Meindl, Agnes Padovani, Thomas K. Gaylord, Elias N. Glytsis, Sue Ann B. Allen
  • Stress compensation layer systems for improved second level solder joint reliability
    Publication number: 20050068757
    Abstract: According to one aspect of the present invention, an electronic assembly and a method of forming an electronic assembly are provided. A semiconductor package includes a package substrate with a microelectronic die mounted to a first side and contact formations attached to a second side thereof. A stress compensation layer is formed on the first surface between the contact formations. The semiconductor package is then attached to a circuit board leaving an air space between the stress compensation layer and the circuit board. The stress compensation layer reduces stress on the contact formations and increases solder joint reliability.
    Type: Application
    Filed: September 30, 2003
    Publication date: March 31, 2005
    Inventors: Saikumar Jayaraman, Terry Sterrett, Connie Gettinger, Vijay Wakharkar, Agnes Padovani
  • Optical waveguides formed from nano air-gap inter-layer dielectric materials and methods of fabrication thereof
    Publication number: 20020186950
    Abstract: Waveguides and methods of fabrication thereof are presented. A representative waveguide includes a waveguide core and a cladding layer, where the cladding layer surrounds the waveguide core. The waveguide core and cladding can be made of a host material having a plurality of nano-pores, wherein the nano-pores include a sacrificial material, and the sacrificial material can be selectively decomposed in both the core and cladding layers to form a plurality of nano air-gaps.
    Type: Application
    Filed: May 10, 2002
    Publication date: December 12, 2002
    Inventors: Tony Mule', Paul Kohl, James D. Meindl, Agnes Padovani, Thomas K. Gaylord, Elias N. Glytsis, Sue Ann B. Allen