Patents by Inventor Agnes Rogge

Agnes Rogge has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Silicon chip having inclined contact pads and electronic module comprising such a chip
    Patent number: 7823322
    Abstract: A semiconductor chip has an active face in which an integrated circuit region is implanted. The chip includes an inclined lateral contact pad extending beneath the plane of the active face and electrically linked to the integrated circuit region. An electronic module includes a substrate having a cavity in which the chip is arranged. The module can be applied to the production of thin contactless micro-modules for smart cards and contactless electronic badges and tags.
    Type: Grant
    Filed: November 9, 2007
    Date of Patent: November 2, 2010
    Assignee: STMicroelectronics SA
    Inventors: Romain Palmade, Agnes Rogge
  • Electronic micromodule and method for manufacturing the same
    Patent number: 7667329
    Abstract: A method for manufacturing a micromodule comprising an integrated circuit and an antenna coil electrically connected to the integrated circuit. The method includes manufacturing the integrated circuit and first contact pads of the integrated circuit on a first wafer of semiconductor material, making a conductive winding forming a coil and second contact pads of the coil on a second wafer of semiconductor material, and assembling the first and the second wafers face to face while putting the second contact pads of the coil in contact with the second contact pads of the integrated circuit.
    Type: Grant
    Filed: November 20, 2006
    Date of Patent: February 23, 2010
    Assignee: STMicroelectronics SA
    Inventor: Agnes Rogge
  • SILICON CHIP HAVING INCLINED CONTACT PADS AND ELECTRONIC MODULE COMPRISING SUCH A CHIP
    Publication number: 20080224320
    Abstract: A semiconductor chip has an active face in which an integrated circuit region is implanted. The chip includes an inclined lateral contact pad extending beneath the plane of the active face and electrically linked to the integrated circuit region. An electronic module includes a substrate having a cavity in which the chip is arranged. The module can be applied to the production of thin contactless micro-modules for smart cards and contactless electronic badges and tags.
    Type: Application
    Filed: November 9, 2007
    Publication date: September 18, 2008
    Applicant: STMICROELECTRONICS SA
    Inventors: Romain Palmade, Agnes Rogge
  • ELECTRONIC MICROMODULE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20070148981
    Abstract: A method for manufacturing a micromodule comprising an integrated circuit and an antenna coil electrically connected to the integrated circuit. The method includes manufacturing the integrated circuit and first contact pads of the integrated circuit on a first wafer of semiconductor material, making a conductive winding forming a coil and second contact pads of the coil on a second wafer of semiconductor material, and assembling the first and the second wafers face to face while putting the second contact pads of the coil in contact with the second contact pads of the integrated circuit.
    Type: Application
    Filed: November 20, 2006
    Publication date: June 28, 2007
    Applicant: STMicroelectronics SA
    Inventor: Agnes Rogge