Abstract: The present invention relates to a detection circuitry for detecting bonding conditions on segmented bond pads of a semiconductor device, the bonding conditions representing good or bad contacts on the bond pads. The detection circuitry comprises a segmented bond pad (1, 11) having at least two parts (2, 3, 12, 13) being electrically separated from each other, and a supplying unit (S1, S2, R1, R2) being adapted for supplying predetermined signals to at least one of the at least two parts of the segmented bond pad. Furthermore, a detector (4, 14) is provided for receiving from at least one of the at least two parts of the segmented bond pad sensing signals derived from said predetermined signals, and for determining the bonding conditions based on said received sensing signals indicative of a good or bad bonding contact on the segmented bond pad.

Abstract: The present invention relates to a method and device for monitoring a lithographic process of an integrated circuit. In a first step a design for an integrated circuit is provided. The integrated circuit comprises at least an integrated circuit transistor pair having a gate of a first transistor connected to a gate of a second transistor. The gate of the second transistor is designed such that it has a predetermined overlap with respect to a source and a drain of the second transistor. A detection circuit is connected to the at least an integrated circuit transistor pair for detecting if in operation functionality of the second transistor of each of the at least an integrated circuit transistor pair is one of a transistor and a short circuit. The integrated circuit is then manufactured in dependence upon the desogn. After manufacturing, the detection circuit is used to determine the functionality of the second transistor of each of the at least an integrated circuit transistor pair.