Abstract: To accommodate high power densities associated with high performance integrated circuits, an integrated circuit package includes a heat-dissipating structure in which heat is dissipated from a surface of a die to an integrated heat spreader (IHS) through a high capacity thermal interface formed of metal that has been injected in a semi-solid state. In one embodiment, vacuum and a shear-controlled viscosity enable semi-solid metallic material to fill a narrow chamber between the die surface and a specially shaped mold plate that doubles as an IHS, without inducing voids in the solidified metal. In another embodiment, an injection machine is disclosed. Methods of fabrication, as well as application of the package to an electronic assembly and to an electronic system, are also described.

Abstract: A heat sink that dissipates heat from an electronic device. The heat sink includes a base that is adapted to be thermally coupled to the electronic device, and a fin that is thermally coupled to the base. The fin includes a first portion made from a first material and a second portion made from a second material. One edge of the first portion and an opposing edge of the second portion form at least one of a lap joint and a butt joint between the first portion and the second portion. In some forms, the first portion of the fin is a copper portion that is thermally coupled to a copper base to conduct thermal energy away from the base, and the second portion of the fin is aluminum.

Abstract: To accommodate high power densities associated with high performance integrated circuits, an integrated circuit package includes a heat-dissipating structure in which heat is dissipated from a surface of a die to an integrated heat spreader (IHS) through a high capacity thermal interface formed of metal that has been injected in a semi-solid state. In one embodiment, vacuum and a shear-controlled viscosity enable semi-solid metallic material to fill a narrow chamber between the die surface and a specially shaped mold plate that doubles as an IHS, without inducing voids in the solidified metal. In another embodiment, an injection machine is disclosed. Methods of fabrication, as well as application of the package to an electronic assembly and to an electronic system, are also described.

Abstract: A heat sink that dissipates heat from an electronic device. The heat sink includes a base that is adapted to be thermally coupled to the electronic device, and a fin that is thermally coupled to the base. The fin includes a first portion made from a first material and a second portion made from a second material. One edge of the first portion and an opposing edge of the second portion form at least one of a lap joint and a butt joint between the first portion and the second portion. In some forms, the first portion of the fin is a copper portion that is thermally coupled to a copper base to conduct thermal energy away from the base, and the second portion of the fin is aluminum.

Abstract: A heat sink that dissipates heat from an electronic device. The heat sink comprises a base and one or more fins. The base is copper and is thermally coupled to an integrated circuit that includes a high-powered processor. The fins each include a copper portion and an aluminum portion. The copper portion of the fin is thermally coupled to the base to conduct thermal energy away from the base. The remainder of the fin is formed from aluminum.

Abstract: To accommodate high power densities associated with high performance integrated circuits, an integrated circuit package includes a heat-dissipating structure in which heat is dissipated from a surface of a die to an integrated heat spreader (IHS) through a high capacity thermal interface formed of metal that has been injected in a semi-solid state. In one embodiment, vacuum and a shear-controlled viscosity enable semi-solid metallic material to fill a narrow chamber between the die surface and a specially shaped mold plate that doubles as an IHS, without inducing voids in the solidified metal. In another embodiment, an injection machine is disclosed. Methods of fabrication, as well as application of the package to an electronic assembly and to an electronic system, are also described.

Abstract: A scroll compressor includes a stationary scroll and a moveable scroll. The stationary scroll has a top surface, a bottom surface, and side edges extending between the top surface and the bottom surface. The moveable scroll moves in a path between the side edges of the stationary scroll. The moveable scroll has a top surface, a bottom surface, and side surfaces having side edges extending between the top surface and the bottom surface. At least one of the top surface and the bottom surface of the moveable scroll includes at least one inner ridge and an outer ridge, and a valley is located between each of the at least one inner ridge and the outer ridge.

Abstract: A heat sink that dissipates heat from an electronic device. The heat sink comprises a base and one or more fins. The base is copper and is thermally coupled to an integrated circuit that includes a high-powered processor. The fins each include a copper portion and an aluminum portion. The copper portion of the fin is thermally coupled to the base to conduct thermal energy away from the base. The remainder of the fin is formed from aluminum.

Abstract: A scroll compressor includes a stationary scroll and a moveable scroll. The stationary scroll has a top surface, a bottom surface, and side edges extending between the top surface and the bottom surface. The moveable scroll moves in a path between the side edges of the stationary scroll. The moveable scroll has a top surface, a bottom surface, and side surfaces having side edges extending between the top surface and the bottom surface. At least one of the top surface and the bottom surface of the moveable scroll includes at least one inner ridge and an outer ridge, and a valley is located between each of the at least one inner ridge and the outer ridge.