Patents by Inventor Ah Beng Lim

Ah Beng Lim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Bi-directional singulation system and method
    Patent number: 6826986
    Abstract: A sawing system (200) incorporates a vision zone (220) between a loading/unloading zone (115) and a sawing zone (210). This arrangement allows a dual spindle counter rotating saw assembly (230) to be more rigidly mounted, which reduces the displacement of the saw assembly during the sawing process. This, advantageously reduces the variation in the cut made by the saw blades of the saw assembly to comply with a predetermined required tolerance. In addition, with the vision zone (220) located between the loading/unloading zone (115) and the sawing zone (210), a semiconductor wafer or substrate is transported from the loading/unloading zone (115) to the vision zone (220) without passing the sawing zone (210). Consequently, exposure of a semiconductor wafer or substrate to water or debris from the sawing process is avoided, and imaging can be performed at the vision zone (220) without water or debris adversely affecting the imaging.
    Type: Grant
    Filed: May 3, 2002
    Date of Patent: December 7, 2004
    Inventors: Ah Beng Lim, Eng Hwa Chua, Steven John Diprinzio
  • Bi-directional singulation system and method
    Publication number: 20020162438
    Abstract: A sawing system (200) incorporates a vision zone (220) between a loading/unloading zone (115) and a sawing zone (210). This arrangement allows a dual spindle counter rotating saw assembly (230) to be more rigidly mounted, which reduces the displacement of the saw assembly during the sawing process. This, advantageously reduces the variation in the cut made by the saw blades of the saw assembly to comply with a predetermined required tolerance. In addition, with the vision zone (220) located between the loading/unloading zone (115) and the sawing zone (210), a semiconductor wafer or substrate is transported from the loading/unloading zone (115) to the vision zone (220) without passing the sawing zone (210). Consequently, exposure of a semiconductor wafer or substrate to water or debris from the sawing process is avoided, and imaging can be performed at the vision zone (220) without water or debris adversely affecting the imaging.
    Type: Application
    Filed: May 3, 2002
    Publication date: November 7, 2002
    Inventors: Ah Beng Lim, Eng Hwa Chua, Steven John Diprinzio