Patents by Inventor Ah Kow Chin

Ah Kow Chin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9911666
    Abstract: There is provided an apparatus and method for inspecting a semiconductor package. The apparatus includes at least one 3D camera positioned at a first angle relative to a normal axis of the semiconductor package; and a light source configured to provide illumination for the at least one 3D camera, the light source being directed at the semiconductor package. The method includes casting a shadow of a bonded wire onto the semiconductor package; obtaining a 3D image of the semiconductor package; determining a distance S of the shadow and the bonded wire in the image; and obtaining a wire loop height H of the bonded wire.
    Type: Grant
    Filed: November 10, 2014
    Date of Patent: March 6, 2018
    Assignee: SAEDGE VISION SOLUTIONS PTE. LTD.
    Inventors: Ah Kow Chin, Choong Fatt Ho, Victor Vertoprakhov, Soon Wei Wong
  • Publication number: 20160254199
    Abstract: There is provided an apparatus and method for inspecting a semiconductor package. The apparatus includes at least one 3D camera positioned at a first angle relative to a normal axis of the semiconductor package; and a light source configured to provide illumination for the at least one 3D camera, the light source being directed at the semiconductor package. The method includes casting a shadow of a bonded wire onto the semiconductor package; obtaining a 3D image of the semiconductor package; determining a distance S of the shadow and the bonded wire in the image; and obtaining a wire loop height H of the bonded wire.
    Type: Application
    Filed: November 10, 2014
    Publication date: September 1, 2016
    Applicant: SAEDGE VISION SOLUTIONS PTE LTD
    Inventors: Ah Kow CHIN, Choong Fatt HO, Victor VERTOPRAKHOV, Soon Wei WONG
  • Patent number: 7679758
    Abstract: A method of optically inspecting a fastener to determine whether it meets two or more dimensional parameters is provided. The method includes using centrifugal force to place the fastener in a predetermined location. Two or more sets of image data of the fastener are generated from two or more corresponding different angles. Fastener pass/fail data is generated using a dimensional requirement associated with each set of image data.
    Type: Grant
    Filed: April 29, 2005
    Date of Patent: March 16, 2010
    Assignee: Microview Technologies PTE Ltd.
    Inventors: Wong Su Wei, Victor Vertoprakhov, Zhou Wensen, Noor Ashedah Binti Jusoh, Tian Poh Yew, Ah Kow Chin, Chee Leong Chua