Patents by Inventor Ah Ram Pyun

Ah Ram Pyun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Adhesive composition for stealth dicing of semiconductor, adhesive film, and semiconductor device including the adhesive film
    Patent number: 8623512
    Abstract: An adhesive composition for stealth dicing of a semiconductor, an adhesive film, and a semiconductor device including the adhesive film, the adhesive composition including a polymer resin, the polymer resin having a glass transition temperature of about 5° C. to about 35° C., an epoxy resin, the epoxy resin including a liquid epoxy resin and a solid epoxy resin, a phenolic resin curing agent, an inorganic filler, a curing catalyst, and a silane coupling agent.
    Type: Grant
    Filed: December 16, 2010
    Date of Patent: January 7, 2014
    Assignee: Cheil Industries, Inc.
    Inventors: Ah Ram Pyun, Jae Hyun Cho, Ki Tae Song
  • Adhesive composition for a semiconductor device, adhesive film, and dicing die-bonding film
    Patent number: 8557896
    Abstract: An adhesive composition for semiconductor devices, an adhesive film, and a dicing die bonding film, the adhesive composition including an elastomer resin, an epoxy resin, a curable phenolic resin, a curing accelerator, a silane coupling agent, and a filler, wherein the silane coupling agent includes an epoxy group-containing silane coupling agent and a transition metal scavenging functional group-containing silane coupling agent.
    Type: Grant
    Filed: December 27, 2010
    Date of Patent: October 15, 2013
    Assignee: Cheil Industries, Inc.
    Inventors: Chul Jeong, Ki Tae Song, Han Nim Choi, Su Mi Im, Ah Ram Pyun, Sang Jin Kim
  • ADHESIVE COMPOSITION FOR A SEMICONDUCTOR DEVICE, ADHESIVE FILM, AND DICING DIE-BONDING FILM
    Publication number: 20110160339
    Abstract: An adhesive composition for semiconductor devices, an adhesive film, and a dicing die bonding film, the adhesive composition including an elastomer resin, an epoxy resin, a curable phenolic resin, a curing accelerator, a silane coupling agent, and a filler, wherein the silane coupling agent includes an epoxy group-containing silane coupling agent and a transition metal scavenging functional group-containing silane coupling agent.
    Type: Application
    Filed: December 27, 2010
    Publication date: June 30, 2011
    Inventors: Chul JEONG, Ki Tae Song, Han Nim Choi, Su Mi Im, Ah Ram Pyun, Sang Jin Kim
  • ADHESIVE COMPOSITION FOR STEALTH DICING OF SEMICONDUCTOR, ADHESIVE FILM, AND SEMICONDUCTOR DEVICE INCLUDING THE ADHESIVE FILM
    Publication number: 20110152394
    Abstract: An adhesive composition for stealth dicing of a semiconductor, an adhesive film, and a semiconductor device including the adhesive film, the adhesive composition including a polymer resin, the polymer resin having a glass transition temperature of about 5° C. to about 35° C., an epoxy resin, the epoxy resin including a liquid epoxy resin and a solid epoxy resin, a phenolic epoxy resin curing agent, an inorganic filler, a curing catalyst, and a silane coupling agent.
    Type: Application
    Filed: December 16, 2010
    Publication date: June 23, 2011
    Inventors: Ah Ram PYUN, Jae Hyun Cho, Ki Tae Song
  • Adhesive film composition, associated dicing die bonding film, and die package
    Patent number: 7863758
    Abstract: An adhesive film composition includes a polyester-based thermoplastic resin, an elastomer resin containing at least one of a hydroxyl group, a carboxyl group, or an epoxy group, an epoxy resin, a phenol curing agent, one or more of a latent catalytic curing agent or a curing catalyst, a silane coupling agent, and a filler.
    Type: Grant
    Filed: December 7, 2007
    Date of Patent: January 4, 2011
    Assignee: Cheil Industries, Inc.
    Inventors: Ki Sung Jung, Wan Jung Kim, Yong Woo Hong, Chang Bum Chung, Chul Jeong, Ah Ram Pyun, Su Mi Im, Kyoung Jin Ha
  • Adhesive film composition for semiconductor assembly, adhesive film, dicing die bonding film, device package, and associated methods
    Publication number: 20090162650
    Abstract: An adhesive film composition for semiconductor assembly includes an elastomer resin, an epoxy resin, a phenolic curing resin, and a silsesquioxane oligomer. The silsesquioxane oligomer may be present in an amount of about 0.01 to about 3 wt. %, based on the total solids content of the composition.
    Type: Application
    Filed: December 19, 2008
    Publication date: June 25, 2009
    Inventors: Yong Woo Hong, Wan Jung Kim, Su Mi Im, Ah Ram Pyun, Chul Jeong, Sang Jin Kim, Chang Beom Chung
  • Adhesive film composition, associated dicing die bonding film, and die package
    Publication number: 20080145668
    Abstract: An adhesive film composition includes a polyester-based thermoplastic resin, an elastomer resin containing at least one of a hydroxyl group, a carboxyl group, or an epoxy group, an epoxy resin, a phenol curing agent, one or more of a latent catalytic curing agent or a curing catalyst, a silane coupling agent, and a filler.
    Type: Application
    Filed: December 7, 2007
    Publication date: June 19, 2008
    Inventors: Ki Sung Jung, Wan Jung Kim, Yong Woo Hong, Chang Bum Chung, Chul Jeong, Ah Ram Pyun, Su Mi Im, Kyoung Jin Ha