Patents by Inventor Ah Reum Hwang

Ah Reum Hwang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Compound and organic electronic device comprising the compound
    Patent number: 9680107
    Abstract: Provided are a novel compound and an organic electronic device (OED) including the same. The novel compound has better hole injection and hole transport properties than a conventional material, and thus may enhance thermal stability and efficiency when used as a material for a hole injection or hole transport layer of the OED.
    Type: Grant
    Filed: May 25, 2012
    Date of Patent: June 13, 2017
    Assignee: LMS Co., Ltd.
    Inventors: Joon Ho Jung, Jeong Og Choi, Oh Kwan Kwon, Ah Reum Hwang
  • Novel Compound and Organic Electronic Device Comprising the Compound
    Publication number: 20140203251
    Abstract: Provided are a novel compound and an organic electronic device (OED) including the same. The novel compound has better hole injection and hole transport properties than a conventional material, and thus may enhance thermal stability and efficiency when used as a material for a hole injection or hole transport layer of the OED.
    Type: Application
    Filed: May 25, 2012
    Publication date: July 24, 2014
    Applicant: LMS CO., LTD.
    Inventors: Joon Ho Jung, Jeong Og Choi, Oh Kwan Kwon, Ah Reum Hwang