Patents by Inventor Ah Reum Hwang

Ah Reum Hwang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • HETEROARYL DERIVATIVE COMPOUND AND USE THEREOF
    Publication number: 20240067668
    Abstract: The present invention relates to a heteroaryl derivative compound and a use thereof. Since the heteroaryl derivative of the present invention exhibits excellent inhibitory activity against EGFR, the heteroaryl derivative can be usefully used as a therapeutic agent for EGFR-associated diseases.
    Type: Application
    Filed: December 29, 2021
    Publication date: February 29, 2024
    Inventors: Yi Kyung Ko, Ah Reum Han, Jin Hee Park, Yeong Deok Lee, Hye Rim Im, Kyun Eun Kim, Dong Keun Hwang, Su Been Nam, Myung Hoe Heo, Se Rin Cho, Eun Hwa Ko, Sung Hwan Kim, Hwan Geun Choi
  • Compound and organic electronic device comprising the compound
    Patent number: 9680107
    Abstract: Provided are a novel compound and an organic electronic device (OED) including the same. The novel compound has better hole injection and hole transport properties than a conventional material, and thus may enhance thermal stability and efficiency when used as a material for a hole injection or hole transport layer of the OED.
    Type: Grant
    Filed: May 25, 2012
    Date of Patent: June 13, 2017
    Assignee: LMS Co., Ltd.
    Inventors: Joon Ho Jung, Jeong Og Choi, Oh Kwan Kwon, Ah Reum Hwang
  • Novel Compound and Organic Electronic Device Comprising the Compound
    Publication number: 20140203251
    Abstract: Provided are a novel compound and an organic electronic device (OED) including the same. The novel compound has better hole injection and hole transport properties than a conventional material, and thus may enhance thermal stability and efficiency when used as a material for a hole injection or hole transport layer of the OED.
    Type: Application
    Filed: May 25, 2012
    Publication date: July 24, 2014
    Applicant: LMS CO., LTD.
    Inventors: Joon Ho Jung, Jeong Og Choi, Oh Kwan Kwon, Ah Reum Hwang