Abstract: A semiconductor package and methods for producing the same are described. One example of the semiconductor package is described to include a substrate having a first face and an opposing second face. The package is further described to include a plurality of pads disposed on the first face of the substrate, each of the plurality of pads including a first face and an opposing second face that is in contact with the first face of the substrate. The semiconductor package is further described to include a plurality of solder-on-pad structures provided on a first of the plurality of pads.

Abstract: A semiconductor package and methods for producing the same are described. One example of the semiconductor package is described to include a substrate having a first face and an opposing second face. The package is further described to include a plurality of solderable surfaces formed on the first face of the substrate, a first solderable surface in the plurality of solderable surfaces having a pattern plating structure on an outward facing surface of the first solderable surface. There may also be an amount of solder bonded to the outward facing surface of the first solderable surface, where the pattern plating structure on the outward facing surface of the first solderable surface causes the amount of solder to have a first thickness at its ends, a second thickness at its center, and a discrete transition between the first thickness and the second thickness.

Abstract: A method is provided for forming an internal electromagnetic interference (EMI) shield in a mold cap formed over a printed circuit board (PCB). The method includes forming a trench in the mold cap, the trench extending continuously from a first edge of the mold cap to a second edge of the mold cap, where the trench defines a trench pattern corresponding to desired locations of the internal EMI shield. The method further includes sealing an elastomeric pad on a top surface of the mold cap to form a channel, the channel including at least the trench formed in the mold cap; and filling the channel with a conductive epoxy using a vacuum configured to draw the conductive epoxy from a dispenser, connected to the first edge of the mold cap, through the channel to the second edge of the mold cap based on pressure differential.

Abstract: A module includes a printed circuit board (PCB) having a substrate, component pads on a top surface of the substrate, and contact pads formed on a bottom surface of the substrate. The module further includes a mold compound disposed over the PCB; an external shield disposed over a top surface of the mold compound and on side surfaces of the mold compound and the PCB, where the external shield is configured to provide shielding of at least one component connected to at least one component pad from electromagnetic radiation; and a back-spill barrier formed on the bottom of the substrate. The back-spill barrier surrounds the contact pads, and is configured to prevent the external shield from making contact with the contact pads.

Abstract: In one embodiment, a method for forming an embedded trace substrate includes forming a conductive layer on a carrier. A dielectric film is provided on the conductive layer. Vias are formed in the dielectric film and extend to portions of the conductive layer. A conductive pattern is formed on the dielectric layer and is electrically connected to the conductive layer through the vias. The carrier is removed and portions of the conductive layer are selectively removed to provide a plurality of bumps pads configured to protrude outwardly from the dielectric layer.

Abstract: In one embodiment, a method for forming an embedded trace substrate includes forming a conductive layer on a carrier. A dielectric film is provided on the conductive layer. Vias are formed in the dielectric film and extend to portions of the conductive layer. A conductive pattern is formed on the dielectric layer and is electrically connected to the conductive layer through the vias. The carrier is removed and portions of the conductive layer are selectively removed to provide a plurality of bumps pads configured to protrude outwardly from the dielectric layer.