Patents by Inventor Ah Yoong SIM

Ah Yoong SIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ROTARY DIE BONDING APPARATUS AND METHODOLOGY THEREOF
    Publication number: 20110215134
    Abstract: The present invention relates generally to a rotary die bonding apparatus (102) comprising a vertical motion linear actuator and a rotary motion actuator with a plurality of pick up heads (116) for transferring semiconductor die (122) from diced wafer to the lead frame for die bonding process, wherein said plurality of pick up heads (116) performs its assigned task such as pick (126), die bonding (132), inspection (128) and others simultaneously upon reaching its specific location and rotates to another location upon completion of each task to perform the next assigned task.
    Type: Application
    Filed: November 17, 2010
    Publication date: September 8, 2011
    Inventor: Ah Yoong SIM