Patents by Inventor Ahmad Jalaluddin Yusof

Ahmad Jalaluddin Yusof has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated connector for electronic device
    Patent number: 10355384
    Abstract: In one example an electronic device comprises a chassis and a printed circuit board coupled to the chassis and comprising a body formed from a plurality of laminate layers, and at least one receptacle formed in the body and comprising at least one data connector positioned in the receptacle to provide a communication connection. Other examples may be described.
    Type: Grant
    Filed: September 23, 2015
    Date of Patent: July 16, 2019
    Assignee: INTEL CORPORATION
    Inventors: Kit Chew Chee, Ahmad Jalaluddin Yusof, Tin Poay Chuah
  • INTEGRATED CONNECTOR FOR ELECTRONIC DEVICE
    Publication number: 20180233841
    Abstract: In one example an electronic device comprises a chassis and a printed circuit board coupled to the chassis and comprising a body formed from a plurality of laminate layers, and at least one receptacle formed in the body and comprising at least one data connector positioned in the receptacle to provide a communication connection. Other examples may be described.
    Type: Application
    Filed: September 23, 2015
    Publication date: August 16, 2018
    Applicant: Intel Corporation
    Inventors: Kit Chew Chee, Ahmad Jalaluddin Yusof, Tin Poay Chuah
  • Ground plane having opening and conductive bridge traversing the opening
    Patent number: 7427718
    Abstract: Conductive bridges to traverse openings in ground planes, and methods of making the conductive bridges, are disclosed. In one aspect, an apparatus may include a ground plane, one or more openings defined in the ground plane, such as, for example, conjoined via openings and/or slots, and one or more conductive bridges coupled with the ground plane that traverse the one or more openings.
    Type: Grant
    Filed: September 29, 2004
    Date of Patent: September 23, 2008
    Assignee: Intel Corporation
    Inventors: Kok Siang Ng, Loo Howe Yin, Ahmad Jalaluddin Yusof