Patents by Inventor Ahmad Naiini

Ahmad Naiini has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor stress buffer coating edge bead removal compositions and method for their use
    Publication number: 20030227005
    Abstract: An edge bead remover composition that includes at least one ketone selected from the group consisting of: 1
    Type: Application
    Filed: February 6, 2003
    Publication date: December 11, 2003
    Applicant: ARCH SPECIALTY CHEMICALS, INC.
    Inventors: Laurie J. Peterson, Richard L. Hopla, Ahmad A. Naiini, William D. Weber, Pamela J. Waterson
  • Photosensitive polyimide precursor compositions
    Patent number: 6511789
    Abstract: Reducing inhibition of the photochemical crosslinking by including in the photosensitive polyimide precursor composition a metal inhibitor selected from 1H-tetrazole, 1,2-cyclohexenediamine tetraacetic acid hydrate and 5-mercaptobenzimidazole.
    Type: Grant
    Filed: June 20, 2001
    Date of Patent: January 28, 2003
    Assignee: Arch Specialty Chemicals, Inc.
    Inventors: Ahmad Naiini, Donald Racicot, Andrew J. Roza, William D. Weber, Pamela J. Waterson
  • Photosensitive polyimide precursor compositions
    Publication number: 20020025494
    Abstract: Reducing inhibition of the photochemical crosslinking by including in the photosensitive polyimide precursor composition a metal inhibitor selected from 1H-tetrazole, 1,2-cyclohexenediamine tetraacetic acid hydrate and 5-mercaptobenzimidazole.
    Type: Application
    Filed: June 20, 2001
    Publication date: February 28, 2002
    Applicant: Arch Specialty Chemicals, Inc.
    Inventors: Ahmad Naiini, Donald Racicot, Andrew J. Roza, William D. Weber, Pamela J. Waterson
  • Photosensitive resin compositions
    Patent number: 6214516
    Abstract: A positive photosensitive resin composition comprising (a) a silane diol such as diarylsilane diol or dialkylsilane diol, (b) one or more polybenzoxazole precursors having the structure: wherein Ar1 is a tetravalent aromatic group, aliphatic group, heterocyclic group, or mixtures thereof; Ar2 is a divalent aromatic, heterocyclic, alicyclic, or aliphatic group that optionally may contain silicon; Ar3 is divalent aromatic group, aliphatic group, heterocyclic group, or mixtures thereof; (c) a photosensitive agent, and (d) a solvent. The composition optionally includes an adhesion promoter, leveling agent, or mixtures thereof.
    Type: Grant
    Filed: March 24, 2000
    Date of Patent: April 10, 2001
    Assignee: Arch Specialty Chemicals, Inc.
    Inventors: Pamela J. Waterson, Ahmad Naiini, Steve Lien-Chung Hsu, William D. Weber
  • Photosensitive resin compositions
    Patent number: 6177225
    Abstract: A positive photosensitive resin composition. The composition comprising: (a) a capped polybenzoxazole precursor polymer having the structure; wherein Ar1 is a tetravalent aromatic group, aliphatic group, heterocylic group, or mixtures thereof; Ar2 is a divalent aromatic, heterocyclic, alicyclic, or aliphatic group that optionally may contain silicon; Ar3 is divalent aromatic group, aliphatic group, heterocyclic group, or mixtures thereof; Z is one of the following groups: x is 10 to 1000; y is 0 to 900; and b is 0.10 to 350; (b) a photosensitive agent; and (c) a solvent.
    Type: Grant
    Filed: September 24, 1999
    Date of Patent: January 23, 2001
    Assignee: Arch Specialty Chemicals, Inc.
    Inventors: William D. Weber, Pamela J. Waterson, Steve Lien-Chung Hsu, Ahmad Naiini
  • Photosensitive polybenzoxazole precursor compositions
    Patent number: 6143467
    Abstract: A heat resistant positive-working photosensitive composition that has a polybenzoxazole precursor bearing acid labile functional groups, a photoacid generator, a photosensitizer, and a solvent. The polybenzoxazole precursor bearing acid labile functional groups, has the structure: ##STR1## wherein k.sub.1 is an integer of 1 or 2, k.sub.2 is an interger of 0 or 1, and the sum of k.sub.1 and k.sub.2 is 2; Ar.sub.1 is a tetravalent aromatic, aliphatic, or heterocyclic group, or mixtures thereof; Ar.sub.2 is a divalent aromatic, aliphatic, or heterocyclic group or siloxane group; D is a monovalent acid labile group; and n is an integer from 20 to 200. A portion of Ar.sub.1 can be a divalent aromatic, aliphatic, or heterocyclic diamine moiety such that the fraction of diamine compound is 0-60 mole percent and the sum of diamine and diamino dihydroxy compound is 100%.
    Type: Grant
    Filed: September 24, 1999
    Date of Patent: November 7, 2000
    Assignee: Arch Specialty Chemicals, Inc.
    Inventors: Steve Lien-Chung Hsu, Pamela J. Waterson, Ahmad Naiini, William D. Weber, Sanjay Malik, Andrew J. Blakeney
  • Photosensitive diazonaphthoquinone esters based on selected cyclic alkyl ether-containing phenolics and their use in radiation sensitive mixtures
    Patent number: 6140026
    Abstract: A photosensitive compound comprising at least one o-quinonediazide sulfonic acid ester of a phenolic compound, said esters selected from the group consisting of formula (II): ##STR1## wherein the photosensitive compound is used in a radiation sensitive composition and a process for forming a positive patterned image.
    Type: Grant
    Filed: December 8, 1999
    Date of Patent: October 31, 2000
    Assignee: Arch Specialty Chemicals, Inc.
    Inventors: Andrew J. Blakeney, Arturo N. Medina, Medhat A. Toukhy, Lawrence Ferreira, Alfred T. Jeffries, III, Ahmad A. Naiini
  • Photosensitive resin compositions
    Patent number: 6127086
    Abstract: A positive photosensitive resin composition comprising (a) a silane diol such as diarylsilane diol or dialkylsilane diol, (b) one or more capped polybenzoxazole precursors having the structure: ##STR1## wherein Ar.sub.1 is a tetravalent aromatic group, aliphatic group, heterocyclic group, or mixtures thereof; Ar.sub.2 is a divalent aromatic, heterocyclic, alicyclic, or aliphatic group that optionally may contain silicon; Ar.sub.3 is divalent aromatic group, aliphatic group, heterocyclic group, or mixtures thereof;Z is one of the following groups: ##STR2## x is 10 to 1000; y is 0 to 900; and b is 0.10 to 350; (c) a photosensitive agent, and (d) a solvent. The composition optionally includes an adhesion promoter, leveling agent, or mixtures thereof.
    Type: Grant
    Filed: September 24, 1999
    Date of Patent: October 3, 2000
    Assignee: Arch Specialty Chemicals, Inc.
    Inventors: Pamela J. Waterson, Ahmad Naiini, Steve Lien-Chung Hsu, William D. Weber
  • Photosensitive diazonaphthoquinone esters based on selected cyclic alkyl ether-containing phenolics and their use in radiation sensitive mixtures
    Patent number: 6040107
    Abstract: A photosensitive compound comprising at least one o-quinonediazide sulfonic acid ester of a phenolic compound, said esters selected from the group consisting of formula (II): ##STR1## wherein the photosensitive compound is used in a radiation sensitive composition and a process for forming a positive patterned image.
    Type: Grant
    Filed: February 6, 1998
    Date of Patent: March 21, 2000
    Assignee: Olin Microelectronic Chemicals, Inc.
    Inventors: Andrew J. Blakeney, Arturo N. Medina, Medhat A. Toukhy, Lawrence Ferreira, Alfred T. Jeffries, III, Ahmad A. Naiini
  • Process for making polyimide-polyamic ester copolymers
    Patent number: 5834581
    Abstract: A process for making polyimide-polyamic ester copolymer composition comprisingreacting at least one diamine, a pyromellitic diacid diester compound; at least one other tetracarboxylic diacid diester compound and a selected phosphoramide in the presence of a base catalyst to form a polyimide-polyamic acid ester copolymer.
    Type: Grant
    Filed: April 15, 1997
    Date of Patent: November 10, 1998
    Assignee: Olin Microelectronic Chemicals, Inc.
    Inventors: Ahmad Naiini, Steve L. C. Hsu, William D. Weber, Andrew J. Blakeney
  • Process for making polyimides from diamines and tetracarboxylic diacid diester
    Patent number: 5789525
    Abstract: A process for making polyimide composition comprising reacting at least one diamine, at least one tetracarboxylic diacid diester, selected phosphoramide and at least one base catalyst to form at least one polyimide compound, said reaction carried out at a temperature from about 20.degree. C. to about 60.degree. C. and wherein the molar ratio of diamine:tetracarboxylic diacid diester:phosphoramide:base catalyst is in the range of 0.8-1.2:1:2.5-4.0:2.5-4.0.
    Type: Grant
    Filed: April 15, 1997
    Date of Patent: August 4, 1998
    Assignee: Olin Microelectronic Chemicals, Inc.
    Inventors: Ahmad Naiini, Steve L. C. Hsu, William D. Weber, Andrew J. Blakeney
  • Chemical imidization reagent for polyimide synthesis
    Patent number: 5789524
    Abstract: A process for producing a polyimide composition by reacting at least one polyamic acid or at least one polyamic ester or a mixture of at least one polyamic acid and at least one polyamic ester with a selected phosphoramide in the presence of at least one base catalyst to from a polyimide composition.
    Type: Grant
    Filed: April 15, 1997
    Date of Patent: August 4, 1998
    Assignee: Olin Microelectronic Chemicals, Inc.
    Inventors: Steve L. C. Hsu, Ahmad Naiini, William D. Weber, Andrew J. Blakeney