Patents by Inventor Ahmad Termizi Suhaimi

Ahmad Termizi Suhaimi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lead frame with power bar for semiconductor device
    Patent number: 8933547
    Abstract: A lead frame for a packaged semiconductor device has multiple, configurable power bars that can be selectively electrically connected, such as with bond wires, to each other and/or to other leads of the lead frame to customize the lead frame for different package designs. One or more of the configurable power bars may extend into one or more cut-out regions in a die paddle of the lead frame, which allows for short bond wires to be used to connect the power bars to die pads of a semiconductor die mounted on the die paddle.
    Type: Grant
    Filed: November 21, 2013
    Date of Patent: January 13, 2015
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Jia Lin Yap, Yin Kheng Au, Ahmad Termizi Suhaimi, Seng Kiong Teng, Boon Yew Low, Navas Khan Oratti Kalandar
  • WIRE BONDING METHOD FOR FLEXIBLE SUBSTRATES
    Publication number: 20140374151
    Abstract: A wire bonded electrical interconnection includes a first electrical contact, a second electrical contact, and a bond wire having a first end bonded to the first electrical contact, a second end bonded to the second electrical contact, and a central portion connecting the first and second ends. The central portion includes notches formed during a wire bonding process, with each notch having at least two corners.
    Type: Application
    Filed: June 24, 2013
    Publication date: December 25, 2014
    Inventors: Jia Lin Yap, Poh Leng Eu, Ahmad Termizi Suhaimi