Patents by Inventor Ahmad Zahrain B. Mohamad Shakir

Ahmad Zahrain B. Mohamad Shakir has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Inspection of underfill in integrated circuit package
    Publication number: 20100055848
    Abstract: In inspecting for quality of underfill material dispensed in an IC package, a camera image is captured for the IC package having the underfill material dispensed between an IC die and a package substrate. A data processor analyzes the camera image to determine an occurrence of an unacceptable condition of the underfill material. Pre-heating and/or post-heating of the package substrate before and/or after dispensing the underfill material by a contact-less heater ensures uniform spreading of the underfill material.
    Type: Application
    Filed: October 9, 2009
    Publication date: March 4, 2010
    Inventors: Keng Sang Cha, Tek Seng Tan, Haris Fazelah, Ahmad Zahrain B. Mohamad Shakir
  • Inspection of underfill in integrated circuit package
    Patent number: 7622311
    Abstract: In inspecting for quality of underfill material dispensed in an IC package, a camera image is captured for the IC package having the underfill material dispensed between an IC die and a package substrate. A data processor analyzes the camera image to determine an occurrence of an unacceptable condition of the underfill material. Pre-heating and/or post-heating of the package substrate before and/or after dispensing the underfill material by a contact-less heater ensures uniform spreading of the underfill material.
    Type: Grant
    Filed: November 30, 2005
    Date of Patent: November 24, 2009
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Keng Sang Cha, Tek Seng Tan, Haris Fazelah, Ahmad Zahrain B. Mohamad Shakir