Abstract: Interfacial convective assembly can assemble any type of nanoparticles or other nanoelements in minutes to form microscale and nanoscale patterns in vias or trenches in patterned substrates. The nanoelements can be assembled on both hydrophilic and hydrophobic surfaces. Nanoparticles can fuse during the process to provide solid or single crystalline electrical circuit components.

Abstract: Nanoscale patterns prepared by lithography are used to direct the self-assembly of amphiphilic molecules to form patterned nanosubstrates having a desired distribution of chemical functional moieties. These patterns can be fabricated over a large area and require no special limitations on the chemistry the assembled amphiphiles. Hydrophilic/hydrophobic patterns can be created and used to direct the deposition of a single functional component to specific regions of the surface or to selectively assemble polymer blends to desired sites in a one step fashion with high specificity and selectivity. The selective deposition of functional moieties on a patterned surface can be based on electrostatic forces, hydrogen bonding, or hydrophobic interactions.

Abstract: A method for forming metal-polymer hybrid tooling includes patterning a surface of a member such as a silicon wafer, stainless steel, nickel or nickel alloy, engaging a polymer layer with the patterned features of the surface of the silicon wafer to form the polymer layer having a reverse of the patterned surface the silicon wafer, removing the patterned polymer layer to expose a patterned polymer layer surface, depositing a metallic layer on the patterned polymer layer surface, and wherein the deposited metallic layer on the patterned polymer layer is operable to form parts with features having a width dimension between about 0.01 microns and about 100 microns and a height dimension of between about 0.01 micron and about 800 microns (e.g., up to aspect ratio of 8).

Abstract: A variety of techniques may be employed, alone or in combination, to enhance contact between a processed substrate and applied megasonic energy. In accordance with one embodiment of the new invention, the vibration plate is brought into intimate contact with one surface of the substrate, while cleaning or processing fluid contacts the other. In accordance with an alternative embodiment of the present invention, a reflecting surface may be provided to cause emanated energy to be reflected back into the near field and make it more uniform. In accordance with another alternative embodiment of the present invention, energy may be transferred across a substrate bounded on both sides by liquid with incidence of megasonic energy that is either normal to the substrate surface or within a critical range of incident angles. In yet another embodiment, generated dilatational waves may be converted to surface waves prior to contacting the substrate.

Abstract: A fast single-article megasonic cleaning system (200) is used to clean substrates (such as semiconductor wafers, flat panel display glass, etc.) at frequencies of 400 kHz-20,000 kHz or higher. The technique provides a single-wafer cleaning process that reduces the cleaning time from the 10-20 minutes typical of the prior art to 15-60 seconds. The system utilizes concentrated megasonic energy on one wafer (90) to dramatically reduce cleaning time. The system uses a transducer (210) or a pair or transducers (210a, 210b) parallel to the substrate (90) to be cleaned where the transducer area is more than about 40% of the substrate area. Two alternate configurations are disclosed, one utilizing a horizontal wafer arrangement and the second utilizing a vertical wafer arrangement. The latter requires a smaller floor area.