Abstract: Embodiments disclosed herein include a coupled inductor. In an embodiment, the coupled inductor comprises a first inductor and a second inductor. In an embodiment, the first inductor can be coupled to the first inductor. In an embodiment, the coupled inductor further comprises a first switch coupled to the first inductor, where the first switch comprises gallium and nitrogen, and a second switch coupled to the second inductor, where the second switch comprises gallium and nitrogen.

Abstract: Described herein is a modular parallel processor and associated manufacturing method in which the parallel processor is assembled from multiple chiplets that populate multiple chiplet slots of an active base chiplet die. The multiple chiplets are tested to determine characteristics of the chiplet, such as a number of functional units or a power consumption metric for the chiplet. The multiple chiplet slots can be configured to be populated by one or more chunks of multiple chiplets, where each chunk has a pre-determined collective value. The pre-determined collective value can be a total number of functional execution cores within a chunk or a collective power metric for the chunk.

Abstract: A system includes multiple processors and a power controller. Each processor includes a throttling engine. The power controller is to, in response to a determination that a first power consumption level exceeds a first threshold, assert a critical signal to each throttling engine of the plurality of processors. Further, for each processor, the throttling engine of the processor is to perform a sequence of multiple throttling states while the critical signal is asserted by the power controller, where the sequence of multiple throttling states is performed according to a state machine of the throttling engine. Other embodiments are described and claimed.

Abstract: A system includes multiple processors and a power controller. Each processor includes a throttling engine. The power controller is to, in response to a determination that a first power consumption level exceeds a first threshold, assert a critical signal to each throttling engine of the plurality of processors. Further, for each processor, the throttling engine of the processor is to perform a sequence of multiple throttling states while the critical signal is asserted by the power controller, where the sequence of multiple throttling states is performed according to a state machine of the throttling engine. Other embodiments are described and claimed.

Abstract: A system includes multiple processors and a power controller. Each processor includes a throttling engine. The power controller is to, in response to a determination that a first power consumption level exceeds a first threshold, assert a critical signal to each throttling engine of the plurality of processors. Further, for each processor, the throttling engine of the processor is to perform a sequence of multiple throttling states while the critical signal is asserted by the power controller, where the sequence of multiple throttling states is performed according to a state machine of the throttling engine. Other embodiments are described and claimed.

Abstract: An integrated circuit (IC) die package substrate comprises a first trace upon, or embedded within, a dielectric material. The first trace comprises a first metal and a first via coupled to the first trace. The first via comprises the first metal and a second trace upon, or embedded within, the dielectric material. A second via is coupled to the second trace, and at least one of the second trace or the second via comprises a second metal with a different microstructure or composition than the first metal.

Abstract: A DC-DC converter circuit includes a switched tank converter configured to output a switching waveform. The DC-DC converter circuit further includes a transformer coupled to the switched tank converter to receive the switching waveform output by the switched tank converter across a primary winding of the transformer.