Abstract: A package structure of a directly modulated laser in a photonics module includes a thermoelectric cooler including multiple conductor traces formed in a cool surface. The package structure further includes a directly modulated laser (DML) chip having a first electrode being attached with the cool surface and a second electrode at a distance away from the cool surface. Additionally, the package structure includes an interposer having a plurality of through-holes formed between a first surface to a second surface. The first surface is mounted to the cool surface such that each through-hole is aligned with one of the multiple conductor traces and the second surface being leveled with the second electrode. Moreover, the package structure includes a driver disposed on the second surface of the interposer with at least a galvanically coupled output port coupled directly to the second electrode of the DML chip.

Abstract: A package structure of a directly modulated laser in a photonics module includes a thermoelectric cooler including multiple conductor traces formed in a cool surface. The package structure further includes a directly modulated laser (DML) chip having a first electrode being attached with the cool surface and a second electrode at a distance away from the cool surface. Additionally, the package structure includes an interposer having a plurality of through-holes formed between a first surface to a second surface. The first surface is mounted to the cool surface such that each through-hole is aligned with one of the multiple conductor traces and the second surface being leveled with the second electrode. Moreover, the package structure includes a driver disposed on the second surface of the interposer with at least a galvanically coupled output port coupled directly to the second electrode of the DML chip.

Abstract: The invention relates to an amplification circuit (100), comprising: a VGA (2), an AGC loop (10) for automatically controlling the gain of the VGA (2), a switching circuit (14) for switching between an AGC mode, in which the gain of the VGA (2) is automatically controlled by an output signal of the AGC loop (10) and a manual gain control, MGC, mode, in which the gain of the VGA (2) can be manually controlled by an input signal, and a read/write circuit (30) with a contact (31) for connection to a peripheral system, wherein the read/write circuit (30) is configured, in the MGC mode, to provide the input signal from the contact (31) via a write-mode path (32) to the VGA (2), and, in the AGC mode, to provide the output signal of the AGC loop (10) via a read-mode path (33) on the contact (31).

Abstract: A package structure of a directly modulated laser in a photonics module includes a thermoelectric cooler including multiple conductor traces formed in a cool surface. The package structure further includes a directly modulated laser (DML) chip having a first electrode being attached with the cool surface and a second electrode at a distance away from the cool surface. Additionally, the package structure includes an interposer having a plurality of through-holes formed between a first surface to a second surface. The first surface is mounted to the cool surface such that each through-hole is aligned with one of the multiple conductor traces and the second surface being leveled with the second electrode. Moreover, the package structure includes a driver disposed on the second surface of the interposer with at least a galvanically coupled output port coupled directly to the second electrode of the DML chip.

Abstract: The invention relates to an amplification circuit (100), comprising: a VGA (2), an AGC loop (10) for automatically controlling the gain of the VGA (2), a switching circuit (14) for switching between an AGC mode, in which the gain of the VGA (2) is automatically controlled by an output signal of the AGC loop (10) and a manual gain control, MGC, mode, in which the gain of the VGA (2) can be manually controlled by an input signal, and a read/write circuit (30) with a contact (31) for connection to a peripheral system, wherein the read/write circuit (30) is configured, in the MGC mode, to provide the input signal from the contact (31) via a write-mode path (32) to the VGA (2), and, in the AGC mode, to provide the output signal of the AGC loop (10) via a read-mode path (33) on the contact (31).