Abstract: The present disclosure concerns an atomic layer deposition device for area-selective deposition of a target material layer onto a deposition area of a substrate surface further comprising a non-deposition area. In use the substrate is conveyed along a plurality of deposition and separator spaces including at least two gas separator spaces provided with at least a separator gas inlet and a separator drain for, in use exposing the substrate to a separator gas flow. Wherein at least one of the gas separator spaces forms a combined separator-inhibitor gas flow comprising a separator gas and inhibitor moieties. The inhibitor moieties selectively adhering to the non-deposition area to form an inhibition layer reducing adsorption of precursor moieties. In a preferred embodiment the device includes a back-etching space to increase selectivity of the deposition process.

Abstract: A foldable thin film device assembly is provided comprising: a flexible thin film device with a thickness smaller than 50 micrometer. The thin film device has a stack of electroactive layers formed on a substrate. A protective inorganic capping layer caps the stack of electroactive layers and a backside elastomeric layer backs the flexible thin film device. A frontside transparent elastomeric layer covers the flexible thin film device, and backside and frontside flexible layers are dimensioned to mechanically form a neutral line for the protective inorganic layer. The elastomeric material has a Young's modulus smaller than 100 MPa smaller than 100 MPa and thickness larger than 100 micron, with a flexural rigidity equal or larger than the thin film device.

Abstract: A foldable thin film device assembly is provided comprising: a flexible thin film device with a thickness smaller than 50 micrometer. The thin film device has a stack of electroactive layers formed on a substrate. A protective inorganic capping layer caps the stack of electroactive layers and a backside elastomeric layer backs the flexible thin film device. A frontside transparent elastomeric layer covers the flexible thin film device, and backside and frontside flexible layers are dimensioned to mechanically form a neutral line for the protective inorganic layer. The elastomeric material has a Young's modulus smaller than 100 MPa smaller than 100 MPa and thickness larger than 100 micron, with a flexural rigidity equal or larger than the thin film device.