Abstract: An IC device includes a multilayer metal line that is at least partially surrounded by one or more electrical insulators. The multilayer metal line may be formed by stacking four layers on top of one another. The four layers may include a first layer between a second layer and a third layer. The first layer may include Al. The second or third layer may include W. The fourth layer may be a conductive or dielectric layer. The second layer, third layer, and fourth layer can protect the first layer from defects in Al core layer during fabrication or operation of the multilayer metal line. Substrative etch may be performed on the stack of the four layers to form openings. An electrical insulator may be deposited into to the openings to form multiple metal lines that are separated by the electrical insulator. A via may be formed over the third layer.

Abstract: A method and process for treating wood. The steps include preparing isocyanate-based reactive prepolymer resins for impregnation, impregnating wood with these impregnation resins, curing the impregnated wood at elevated temperatures, preparing isocyanate resin-based coating materials and applying these coating materials on the cured impregnated wood and curing the coatings at room or elevated temperatures. The resulting treated wood has substantially improved de-contaminability of the chemical warfare agent VX both initially and after long exposure to degradation effects from sunlight.

Abstract: A method and process for treating wood. The steps include preparing isocyanate-based reactive prepolymer resins for impregnation, impregnating wood with these impregnation resins, curing the impregnated wood at elevated temperatures, preparing isocyanate resin-based coating materials and applying these coating materials on the cured impregnated wood and curing the coatings at room or elevated temperatures.