Abstract: An inductor assembly for use in RF and microwave circuits wherein the inductor is formed of a first spiral wound metal strip that is mounted on a flat surface of a quartz substrate. A metal strip is formed of copper and has a height above the flat surface that is about 30 microns.

Abstract: A monolithic integrated circuit (1) incorporating an inductive component (2) and comprising: a semiconductor substrate layer (2); a passivation layer (4) covering the substrate layer (2); metal contact pads (5) connected to the substrate (2) and passing through the passivation layer (4) in order to be flush with the upper face (6) of the passivation layer (4); which circuit also includes a spiral winding (20) which forms an inductor and lies in a plane parallel to the upper face (6) of the passivation layer (4), said winding (20) consisting of copper turns (21-23, 27, 28) having a thickness of greater than 10 microns, the winding ends forming extensions (12) which extend below the plane of the winding (20) and are connected to the contact pads (5).

Abstract: Microelectromechanical component (1) providing filtering functions, produced on a semiconductor-based substrate, and comprising two input terminals and two output terminals, characterized in that it also comprises:

Abstract: A microelectromechanical component (1) providing filtering functions, produced on a semiconductor-based substrate (10) and comprising two input terminals (7, 8) and two output terminals (26, 27), which also comprises:

Abstract: An inductive component (1), especially intended to be incorporated into a radiofrequency circuit, comprising:

Abstract: A monolithic integrated circuit (1) incorporating an inductive component (2) and comprising:

Abstract: A monolithic integrated circuit (1) incorporating an inductive component (2) and comprising: a semiconductor substrate layer (2); a passivation layer (4) covering the substrate layer (2); metal contact pads (5) connected to the substrate (2) and passing through the passivation layer (4) in order to be flush with the upper face (6) of the passivation layer (4); which circuit also includes a spiral winding (20) which forms an inductor and lies in a plane parallel to the upper face (6) of the passivation layer (4), said winding (20) consisting of copper turns (21-23, 27, 28) having a thickness of greater than 10 microns, the winding ends forming extensions (12) which extend below the plane of the winding (20) and are connected to the contact pads (5).

Abstract: An inductor assembly for use in RF and microwave circuits wherein the inductor is formed of a first spiral wound metal strip that is mounted on a flat surface of a quartz substrate. The metal strip is formed of copper and has a height above the flat surface that is about 30 microns.

Abstract: Apparatus and Method relating to a microcomponent such as an inductor in which copper segments are mounted in parallel channels of a non-conductive substrate so that the top surfaces of the segments are coplanar with the top surface of the substrate. A core material is placed over the top surface of the substrate and conductive arches are arranged to connect one end of each segment with the opposite end of an adjacent segment to form a coil that encircles the core.