Patents by Inventor Ahmed Nur Amin

Ahmed Nur Amin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of making electronic entities
    Patent number: 7724359
    Abstract: Many electronic entities such as integrated circuits and discrete power devices have contact pads formed from successively deposited layers of nickel and a second metal such as gold. The resulting pad structure is used to make external electrical connection such as solder connection. Problems associated with failure of such connections are avoidable by inspecting the surface of the nickel layer for excessive small particle formation.
    Type: Grant
    Filed: May 27, 2008
    Date of Patent: May 25, 2010
    Assignee: Agere Systems Inc.
    Inventors: Ahmed Nur Amin, Mark Adam Bachman, Frank A. Baiocchi, John Michael DeLucca, John William Osenbach
  • Electronic packages
    Patent number: 7671436
    Abstract: Assemblies involving integrated circuit dies (e.g. packaged integrated circuits) and packaged dies electrically connected to circuit boards at times mechanically fail at conducting pads used for electrical interconnection. Such failure is mitigated by underlying appropriate pads with a compliant region having specific characteristics.
    Type: Grant
    Filed: May 2, 2008
    Date of Patent: March 2, 2010
    Assignee: Agere Systems Inc.
    Inventors: Ahmed Nur Amin, Mark Adam Bachman, David Lee Crouthamel, John William Osenbach, Brian Thomas Vaccaro
  • Method of making electronic entities
    Publication number: 20090298286
    Abstract: Many electronic entities such as integrated circuits and discrete power devices have contact pads formed from successively deposited layers of nickel and a second metal such as gold. The resulting pad structure is used to make external electrical connection such as solder connection. Problems associated with failure of such connections are avoidable by inspecting the surface of the nickel layer for excessive small particle formation.
    Type: Application
    Filed: May 27, 2008
    Publication date: December 3, 2009
    Inventors: Ahmed Nur Amin, Mark Adam Bachman, Frank A. Baiocchi, John Michael DeLucca, John William Osenbach
  • Electronic packages
    Publication number: 20090273078
    Abstract: Assemblies involving integrated circuit dies (e.g. packaged integrated circuits) and packaged dies electrically connected to circuit boards at times mechanically fail at conducting pads used for electrical interconnection. Such failure is mitigated by underlying appropriate pads with a compliant region having specific characteristics.
    Type: Application
    Filed: May 2, 2008
    Publication date: November 5, 2009
    Inventors: Ahmed Nur Amin, Mark Adam Bachman, David Lee Crouthamel, John William Osenbach, Brian Thomas Vaccaro