Patents by Inventor Ahmed Sanaa Ahmed Awny

Ahmed Sanaa Ahmed Awny has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Packaging of a directly modulated laser chip in photonics module
    Patent number: 11011886
    Abstract: A package structure of a directly modulated laser in a photonics module includes a thermoelectric cooler including multiple conductor traces formed in a cool surface. The package structure further includes a directly modulated laser (DML) chip having a first electrode being attached with the cool surface and a second electrode at a distance away from the cool surface. Additionally, the package structure includes an interposer having a plurality of through-holes formed between a first surface to a second surface. The first surface is mounted to the cool surface such that each through-hole is aligned with one of the multiple conductor traces and the second surface being leveled with the second electrode. Moreover, the package structure includes a driver disposed on the second surface of the interposer with at least a galvanically coupled output port coupled directly to the second electrode of the DML chip.
    Type: Grant
    Filed: February 26, 2020
    Date of Patent: May 18, 2021
    Assignee: INPHI CORPORATION
    Inventors: Frank Gelhausen, Ahmed Sanaa Ahmed Awny, Edward Pillai, Ulrich Schacht, Oliver Piepenstock
  • PACKAGING OF A DIRECTLY MODULATED LASER CHIP IN PHOTONICS MODULE
    Publication number: 20200194969
    Abstract: A package structure of a directly modulated laser in a photonics module includes a thermoelectric cooler including multiple conductor traces formed in a cool surface. The package structure further includes a directly modulated laser (DML) chip having a first electrode being attached with the cool surface and a second electrode at a distance away from the cool surface. Additionally, the package structure includes an interposer having a plurality of through-holes formed between a first surface to a second surface. The first surface is mounted to the cool surface such that each through-hole is aligned with one of the multiple conductor traces and the second surface being leveled with the second electrode. Moreover, the package structure includes a driver disposed on the second surface of the interposer with at least a galvanically coupled output port coupled directly to the second electrode of the DML chip.
    Type: Application
    Filed: February 26, 2020
    Publication date: June 18, 2020
    Inventors: Frank GELHAUSEN, Ahmed Sanaa AHMED AWNY, Edward PILLAI, Ulrich SCHACHT, Oliver PIEPENSTOCK
  • Packaging of a directly modulated laser chip in photonics module
    Patent number: 10615567
    Abstract: A package structure of a directly modulated laser in a photonics module includes a thermoelectric cooler including multiple conductor traces formed in a cool surface. The package structure further includes a directly modulated laser (DML) chip having a first electrode being attached with the cool surface and a second electrode at a distance away from the cool surface. Additionally, the package structure includes an interposer having a plurality of through-holes formed between a first surface to a second surface. The first surface is mounted to the cool surface such that each through-hole is aligned with one of the multiple conductor traces and the second surface being leveled with the second electrode. Moreover, the package structure includes a driver disposed on the second surface of the interposer with at least a galvanically coupled output port coupled directly to the second electrode of the DML chip.
    Type: Grant
    Filed: February 14, 2018
    Date of Patent: April 7, 2020
    Assignee: INPHI CORPORATION
    Inventors: Frank Gelhausen, Ahmed Sanaa Ahmed Awny, Edward Pillai, Ulrich Schacht, Oliver Piepenstock