Abstract: A hybrid heat pipe assembly includes a baseplate dimensioned to be placed in surface contact with a device. The baseplate is configured to extract heat from the device. A plurality of fins is bonded to the baseplate. The fins are configured to transfer a first portion of the extracted heat from the baseplate to air surrounding the fins. A complex heat pipe extends from the baseplate and has an end positioned within the baseplate. The complex heat pipe is configured to receive and transfer a second portion of the extracted heat transferred from the baseplate. The complex heat pipe is configured to transfer the second portion of heat to a heat pipe fin stack to which.

Abstract: A dual base plate heatsink for use in dissipating heat for electronic devices with thermal contact between fins and the base plates and manufactured without welding. Separately extruded fins are connected to both base plates by placing the fins side by side in channels in both base plates. In order to couple the base plates and finds, the base plates are maintained at a constant relative distance and a swaging tool is passed adjacent the fins and between the base plates in a direction parallel to the surface of the base plates. The swaging tool applies pressure to the base plates to thereby swage the base plates against the ends of the fins.

Abstract: A dual base plate heatsink for use in dissipating heat for electronic devices with thermal contact between fins and the base plates and manufactured without welding. Separately extruded fins are connected to both base plates by placing the fins side by side in channels in both base plates. In order to couple the base plates and finds, the base plates are maintained at a constant relative distance and a swaging tool is passed adjacent the fins and between the base plates in a direction parallel to the surface of the base plates. The swaging tool applies pressure to the base plates to thereby swage the base plates against the ends of the fins.

Abstract: A dual base plate heatsink for use in dissipating heat for electronic devices with thermal contact between fins and the base plates and manufactured without welding. Separately extruded fins are connected to both base plates by placing the fins side by side in channels in both base plates. In order to couple the base plates and the fins, the base plates are maintained at a constant relative distance and a swaging tool is passed adjacent the fins and between the base plates in a direction parallel to the surface of the base plates. The swaging tool applies pressure to the base plates to thereby swage the base plates against the ends of the fins.

Abstract: A dual base plate heatsink for use in dissipating heat for electronic devices has sufficient thermal contact between fins and the base plates and is manufactured without the requirement for welding. Separately extruded fins are connected to both base plates by placing the fins side by side in channels in both base plates. In order to couple the base plates and the fins, the base plates are maintained at a constant relative distance and a swaging tool is passed adjacent the fins and between the base plates in a direction parallel to the surface of the base plates. The swaging tool asserts pressure to the base plates to thereby swage the base plates against the ends of the fins. Undesirable warping of the base plates during the process is reduced or prevented by providing a base plate configuration that minimises the bending moment between the swaged base plate material and the rest of the base plate.