Patents by Inventor AHRAM KANG

AHRAM KANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor chip and semiconductor package
    Patent number: 11640950
    Abstract: A semiconductor chip includes; an intermetal dielectric (IMD) layer on a substrate, an uppermost insulation layer on the IMD layer, the uppermost insulation layer having a dielectric constant different from a dielectric constant of the IMD layer, a metal wiring in the IMD layer, the metal wiring including a via contact and a metal pattern, a metal pad in the uppermost insulation layer, the metal pad being electrically connected to the metal wiring, and a bump pad on the metal pad. An interface portion between the IMD layer and the uppermost insulation layer is disposed at a height of a portion between an upper surface and a lower surface of an uppermost metal pattern in the IMD layer.
    Type: Grant
    Filed: March 24, 2021
    Date of Patent: May 2, 2023
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Byungwook Kim, Ahram Kang, Seongwon Jeong
  • SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE
    Publication number: 20220077095
    Abstract: A semiconductor chip includes; an intermetal dielectric (IMD) layer on a substrate, an uppermost insulation layer on the IMD layer, the uppermost insulation layer having a dielectric constant different from a dielectric constant of the IMD layer, a metal wiring in the IMD layer, the metal wiring including a via contact and a metal pattern, a metal pad in the uppermost insulation layer, the metal pad being electrically connected to the metal wiring, and a bump pad on the metal pad. An interface portion between the IMD layer and the uppermost insulation layer is disposed at a height of a portion between an upper surface and a lower surface of an uppermost metal pattern in the IMD layer.
    Type: Application
    Filed: March 24, 2021
    Publication date: March 10, 2022
    Inventors: BYUNGWOOK KIM, AHRAM KANG, SEONGWON JEONG