Patents by Inventor Ai-Chie Wang

Ai-Chie Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Pre-encapsulated lead frames for microelectronic device packages, and associated methods
    Patent number: 11189548
    Abstract: Pre-encapsulated lead frames suitable for use in microelectronic device packages are disclosed. Individual lead frames can include a set of multiple lead fingers arranged side by side with neighboring lead fingers spaced apart from each other by a corresponding gap. An encapsulating compound at least partially encapsulates the set of lead fingers without encapsulating a microelectronic device. The encapsulating compound can generally fill the plurality of gaps between two adjacent lead fingers.
    Type: Grant
    Filed: June 19, 2017
    Date of Patent: November 30, 2021
    Assignee: Micron Technology, Inc.
    Inventors: Ai-Chie Wang, Choon Kuan Lee, Chin Hui Chong, Wuu Yean Tay
  • PRE-ENCAPSULATED LEAD FRAMES FOR MICROELECTRONIC DEVICE PACKAGES, AND ASSOCIATED METHODS
    Publication number: 20170288177
    Abstract: Pre-encapsulated lead frames suitable for use in microelectronic device packages are disclosed. Individual lead frames can include a set of multiple lead fingers arranged side by side with neighboring lead fingers spaced apart from each other by a corresponding gap. An encapsulating compound at least partially encapsulates the set of lead fingers without encapsulating a microelectronic device. The encapsulating compound can generally fill the plurality of gaps between two adjacent lead fingers.
    Type: Application
    Filed: June 19, 2017
    Publication date: October 5, 2017
    Inventors: Ai Chie Wang, Choon Kuan Lee, Chin Hui Chong, Wuu Yean Tay
  • Pre-encapsulated lead frames for microelectronic device packages, and associated methods
    Patent number: 9721874
    Abstract: Pre-encapsulated lead frames suitable for use in microelectronic device packages are disclosed. Individual lead frames can include a set of multiple lead fingers arranged side by side with neighboring lead fingers spaced apart from each other by a corresponding gap. An encapsulating compound at least partially encapsulates the set of lead fingers without encapsulating a microelectronic device. The encapsulating compound can generally fill the plurality of gaps between two adjacent lead fingers.
    Type: Grant
    Filed: January 22, 2013
    Date of Patent: August 1, 2017
    Assignee: Micron Technology, Inc.
    Inventors: Ai Chie Wang, Choon Kuan Lee, Chin Hui Chong, Wuu Yean Tay
  • Pre-encapsulated lead frames for microelectronic device packages, and associated methods
    Patent number: 8357566
    Abstract: Pre-encapsulated lead frames suitable for use in microelectronic device packages are disclosed. Individual lead frames can include a set of multiple lead fingers arranged side by side with neighboring lead fingers spaced apart from each other by a corresponding gap. An encapsulating compound at least partially encapsulates the set of lead fingers without encapsulating a microelectronic device. The encapsulating compound can generally fill the plurality of gaps between two adjacent lead fingers.
    Type: Grant
    Filed: August 25, 2006
    Date of Patent: January 22, 2013
    Assignee: Micron Technology, Inc.
    Inventors: Ai-Chie Wang, Choon Kuan Lee, Chin Hui Chong, Wuu Yean Tay
  • Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
    Patent number: 8283761
    Abstract: Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices are disclosed herein. In one embodiment, a packaged microelectronic device can include a support member and at least one die in a stacked configuration attached to the support member. The support member may include a leadframe disposed longitudinally between first and second ends and latitudinally between first and second sides. The leadframe includes a lead extending between the first end and the first side.
    Type: Grant
    Filed: June 28, 2011
    Date of Patent: October 9, 2012
    Assignee: Micron Technology, Inc.
    Inventors: Teck Kheng Lee, Voon Siong Chin, Ai Chie Wang
  • PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACKAGED MICROELECTRONIC DEVICES
    Publication number: 20110254144
    Abstract: Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices are disclosed herein. In one embodiment, a packaged microelectronic device can include a support member and at least one die in a stacked configuration attached to the support member. The support member may include a leadframe disposed longitudinally between first and second ends and latitudinally between first and second sides. The leadframe includes a lead extending between the first end and the first side.
    Type: Application
    Filed: June 28, 2011
    Publication date: October 20, 2011
    Applicant: MICRON TECHNOLOGY, INC.
    Inventors: Teck Kheng Lee, Voon Siong Chin, Ai Chie Wang
  • Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
    Patent number: 7968376
    Abstract: Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices are disclosed herein. In one embodiment, a packaged microelectronic device can include a support member and at least one die in a stacked configuration attached to the support member. The support member may include a leadframe disposed longitudinally between first and second ends and latitudinally between first and second sides. The leadframe includes a lead extending between the first end and the first side.
    Type: Grant
    Filed: September 22, 2009
    Date of Patent: June 28, 2011
    Assignee: Micron Technology, Inc.
    Inventors: Teck Kheng Lee, Voon Siong Chin, Ai Chie Wang
  • PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACKAGED MICROELECTRONIC DEVICES
    Publication number: 20100029043
    Abstract: Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices are disclosed herein. In one embodiment, a packaged microelectronic device can include a support member and at least one die in a stacked configuration attached to the support member. The support member may include a leadframe disposed longitudinally between first and second ends and latitudinally between first and second sides. The leadframe includes a lead extending between the first end and the first side.
    Type: Application
    Filed: September 22, 2009
    Publication date: February 4, 2010
    Applicant: MICRON TECHNOLOGY, INC.
    Inventors: Teck Kheng Lee, Voon Siong Chin, Ai Chie Wang
  • Packaged microelectronic devices with a lead frame
    Patent number: 7612436
    Abstract: Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices are disclosed herein. In one embodiment, a packaged microelectronic device can include a support member and at least one die in a stacked configuration attached to the support member. The support member may include a leadframe disposed longitudinally between first and second ends and latitudinally between first and second sides. The leadframe includes a lead extending between the first end and the first side.
    Type: Grant
    Filed: July 31, 2008
    Date of Patent: November 3, 2009
    Assignee: Micron Technology, Inc.
    Inventors: Teck Kheng Lee, Voon Siong Chin, Ai-Chie Wang
  • Pre-encapsulated lead frames for microelectronic device packages, and associated methods
    Publication number: 20080048301
    Abstract: Pre-encapsulated lead frames suitable for use in microelectronic device packages are disclosed. Individual lead frames can include a set of multiple lead fingers arranged side by side with neighboring lead fingers spaced apart from each other by a corresponding gap. An encapsulating compound at least partially encapsulates the set of lead fingers without encapsulating a microelectronic device. The encapsulating compound can generally fill the plurality of gaps between two adjacent lead fingers.
    Type: Application
    Filed: August 25, 2006
    Publication date: February 28, 2008
    Applicant: Micron Technology, Inc.
    Inventors: Ai-Chie Wang, Choon Kuan Lee, Chin Hui Chong, Wuu Yean Tay