Abstract: An interposer provides a high reliability interface between an LGA connector and a motherboard. The interposer includes a stepped spacer for each solder interconnection which prevents the relaxation of mechanical contact force while ensuring the integrity of each solder interconnection. The interposer provides noble metal plated contact pads on a first surface to receive the contact members of an LGA connector, and contact pads for BGA solder connections for attachment to a motherboard. A description of the processes to manufacture the interposer is also disclosed.

Abstract: The present invention is a cost effective, reworkable, LGA-based interconnection for use between two circuit members such as a ceramic module and an FR4-based system board. The resilient contact members allow the reliable interconnection of two circuit members, even though the circuit members may have significantly different CTEs and have interconnections where the distance from neutral point is great enough to crack BGA or CGA solder connections. For factory reworkable applications, the ends of the contact members are semi-permanently attached to both the module and the system board. For certain field separable applications, semi-permanently attaching only one of the ends of an LGA to either the module or the system board provides increased reliability.

Abstract: A shielded carrier with electrical components is provided, resulting in LGA interposer connectors with improved electrical performance and enhanced functionality. The carrier includes components such as resistors and capacitors on and/or in the carrier. The components are preferably of the surface mount variety or are imbedded within the carrier, due to the inherent lower profile of these form factors. Decoupling capacitors and terminating resistors are two examples of components that may improve performance.

Abstract: The present invention features an interposer that provides a high reliability interface between an LGA connector and a motherboard. The novel interposer overcomes the limitations of prior art interposers by including a stepped spacer for each solder interconnection which prevents the relaxation of mechanical contact force while ensuring the integrity of each solder interconnection. The interposer provides noble metal plated contact pads on a first surface to receive the contact members of an LGA connector, and contact pads for BGA solder connections for attachment to a motherboard. A description of the processes to manufacture the interposer is also disclosed.

Abstract: The present invention provides an electronic package for high speed, high performance semiconductors. It includes a plurality of devices, circuit members and short interconnections between the circuit members for maintaining high electrical performance. Suitable applications requiring high speed, impedance-controlled transmission line buses throughout the entire package include microprocessor and digital signal processor data buses, and high speed memory buses for products such as laptop and handheld computing and telecommunications devices. Circuit members include printed circuit boards and circuit modules, and may be formed from a wide variety of materials with unpacked or packed semiconductors attached directly to the circuit members. Through the use of clamps the package is at least factory reworkable and can be field separable. Thermal management structures may be included to maintain the high density devices within a reliable range of operating temperatures.

Abstract: The present invention provides a process for forming a contact member cable. The cable is a longer version of a contact member and can then be cut into shorter, individual contact members, to meet the particular requirements for a specific connector application. The contact members can be used as the conductive elements for a family of land grid array connectors that provide, among other things, a low profile, uniform electrical and mechanical performance, and reworkability if a contact member is damaged. The connectors are intended to interconnect electrical circuit members such as printed circuit boards, circuit modules, or the like. Such circuit members may be used in information handling system (computer) or telecommunications environments.

Abstract: The present invention provides a carrier with electrical shielding of individual contact elements, resulting in LGA interposer connectors with improved electrical performance. The carrier includes a plurality of openings, each of which may contain an individual contact element. The openings may be plated with conductive material, and may also be commoned to one or more reference voltages (e.g., ground) present on at least one conductive layer of the carrier. The carrier may be as simple as a single unified structure with a conductive layer on one outer surface, or much more complex, having many layers of dielectric and conductive material. The carrier may also provide improved retention of the individual contact elements. The process to assemble one embodiment of the carrier is also disclosed.

Abstract: The present invention provides an electronic package for high speed, high performance semiconductors. It includes a plurality of devices, circuit members and short interconnections between the circuit members for maintaining high electrical performance. Suitable applications requiring high speed, impedance-controlled transmission line buses throughout the entire package include microprocessor and digital signal processor data buses, and high speed memory buses for products such as laptop and handheld computing and telecommunications devices. Circuit members include printed circuit boards and circuit modules, and may be formed from a wide variety of materials with unpacked or packed semiconductors attached directly to the circuit members. Through the use of clamps the package is at least factory reworkable and can be field separable. Thermal management structures may be included to maintain the high density devices within a reliable range of operating temperatures.

Abstract: The present invention is a cost effective, reworkable, LGA-based interconnection for use between two circuit members such as a ceramic module and an FR4-based system board. The resilient contact members allow the reliable interconnection of two circuit members, even though the circuit members may have significantly different CTEs and have interconnections where the distance from neutral point is great enough to crack BGA or CGA solder connections. For factory reworkable applications, the ends of the contact members are semi-permanently attached to both the module and the system board. For certain field separable applications, semi-permanently attaching only one of the ends of an LGA to either the module or the system board provides increased reliability.

Abstract: The present invention provides a carrier with electrical shielding of individual contact elements, resulting in LGA interposer connectors with improved electrical performance. The carrier includes a plurality of openings, each of which may contain an individual contact element. The openings may be plated with conductive material, and may also be commoned to one or more reference voltages (e.g., ground) present on at least one conductive layer of the carrier. The carrier may be as simple as a single unified structure with a conductive layer on one outer surface, or much more complex, having many layers of dielectric and conductive material. The carrier may also provide improved retention of the individual contact elements. The process to assemble one embodiment of the carrier is also disclosed.

Abstract: The present invention provides a low profile, high density electronic package for high speed, high performance semiconductors, such as memory devices. It includes a plurality of modules having high speed, impedance-controlled transmission line buses, short interconnections between modules and, optionally, driver line terminators built into one of the modules, for maintaining high electrical performance. Suitable applications include microprocessor data buses and memory buses such as RAMBUS and DDR. The modules may be formed on conventional printed circuit cards with unpacked or packed memory chips attached directly to the memory module. Thermal control structures may be included to maintain the high density modules within a reliable range of operating temperatures.

Abstract: The present invention provides a carrier that provides improved retention to the individual contact elements resulting in LGA interposer connectors with improved manufacturability, reliability and more uniform mechanical and electrical performance. In one embodiment, the carrier, which includes upper and lower sections of dielectric material with an adhesive layer in between, includes a plurality of openings, each of which may contain an individual contact element. During assembly of the connector, once the contact elements are inserted, the adhesive layer is reflowed, thereby allowing the carrier to capture the location of the contact elements both with respect to each other as well as to the carrier. Alternately, the carrier may be implemented in a fashion that, while not including an adhesive layer to be reflowed, still provides improved retention of the individual contact elements. These embodiments may by easier to assemble, and less expensive to manufacture, especially in high volumes.

Abstract: The present invention provides a carrier that provides improved retention to the individual contact elements resulting in LGA interposer connectors with improved manufacturability, reliability and more uniform mechanical and electrical performance. In one embodiment, the carrier, which includes upper and lower sections of dielectric material with an adhesive layer in between, includes a plurality of openings, each of which may contain an individual contact element. During assembly of the connector, once the contact elements are inserted, the adhesive layer is reflowed, thereby allowing the carrier to capture the location of the contact elements both with respect to each other as well as to the carrier. Alternately, the carrier may be implemented in a fashion that, while not including an adhesive layer to be reflowed, still provides improved retention of the individual contact elements. These embodiments may by easier to assemble, and less expensive to manufacture, especially in high volumes.