Patents by Inventor AI-HUA LIANG

AI-HUA LIANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for manufacturing printed circuit board with shallow solder pad
    Patent number: 9392693
    Abstract: An exemplary printed circuit board includes a base, solder pads, and signal traces. The base includes outer surfaces. The signal traces having a first height relative to the base are formed on the outer surface of the base. The solder pads having a second height relative to the base are formed on the same surface having the signal traces. The first height of the signal trace is greater than the second height of the solder pad. Exemplary methods for manufacturing the printed circuit board are also provided.
    Type: Grant
    Filed: October 24, 2013
    Date of Patent: July 12, 2016
    Assignee: SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED
    Inventor: Ai-Hua Liang
  • PRINTED CIRCUIT BOARD WITH SHALLOW SOLDER PAD AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20140326485
    Abstract: An exemplary printed circuit board includes a base, solder pads, and signal traces. The base includes outer surfaces. The signal traces having a first height relative to the base are formed on the outer surface of the base. The solder pads having a second height relative to the base are formed on the same surface having the signal traces. The first height of the signal trace is greater than the second height of the solder pad. Exemplary methods for manufacturing the printed circuit board are also provided.
    Type: Application
    Filed: October 24, 2013
    Publication date: November 6, 2014
    Applicant: AMBIT MICROSYSTEMS (ZHONGSHAN) LTD.
    Inventor: AI-HUA LIANG