Patents by Inventor Ai Kuroda

Ai Kuroda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Etchant, replenishment solution and method for producing copper wiring using the same
    Patent number: 7431861
    Abstract: An etchant for copper and copper alloys, includes an aqueous solution containing: 14 to 155 g/liter of cupric ion source in terms of a concentration of copper ions; 7 to 180 g/liter of hydrochloric acid; and 0.1 to 50 g/liter of azole, the azole including nitrogen atoms only as heteroatoms residing in a ring. A method for producing a wiring by etching of copper or copper alloys, includes the step of: etching a portion of a copper layer on an electrical insulative member that is not covered with an etching resist using the above-described etchant so as to form the wiring. Thereby, a fine and dense wiring pattern with reduced undercut can be formed.
    Type: Grant
    Filed: July 22, 2004
    Date of Patent: October 7, 2008
    Assignee: Mec Company Ltd.
    Inventors: Kenji Toda, Yukari Morinaga, Takahiro Teshima, Ai Kuroda
  • Etchant, replenishment solution and method for producing copper wiring using the same
    Publication number: 20050016961
    Abstract: An etchant for copper and copper alloys, includes an aqueous solution containing: 14 to 155 g/liter of cupric ion source in terms of a concentration of copper ions; 7 to 180 g/liter of hydrochloric acid; and 0.1 to 50 g/liter of azole, the azole including nitrogen atoms only as heteroatoms residing in a ring. A method for producing a wiring by etching of copper or copper alloys, includes the step of: etching a portion of a copper layer on an electrical insulative member that is not covered with an etching resist using the above-described etchant so as to form the wiring. Thereby, a fine and dense wiring pattern with reduced undercut can be formed.
    Type: Application
    Filed: July 22, 2004
    Publication date: January 27, 2005
    Applicant: MEC COMPANY LTD.
    Inventors: Kenji Toda, Yukari Morinaga, Takahiro Teshima, Ai Kuroda