Abstract: A method for maintaining optical quality of a display and a display thereof are provided, wherein the display includes a backlight unit, a display unit, and a driving unit, and the method includes: providing a preset gamma value of the display; driving the driving unit based on the preset gamma value of the display to obtain a first display luminance corresponding to the backlight unit according to the preset gamma value; performing local dimming of the backlight unit in the display to obtain a second display brightness value of each area in the measured backlight unit; receiving, by the driving unit, the second display brightness value to compare the second display brightness value with the first display brightness value for obtaining a luminance difference; and providing the brightness difference into the backlight unit for brightness compensation, so that the backlight unit has a third display brightness value.

Abstract: A display and a backlight compensation method thereof are provided, wherein the display includes a backlight unit and a driving unit, and the backlight compensation method includes: providing a gamma value of the display; performing local dimming of the backlight unit according to the gamma value; obtaining an area peak luminance of each area in the backlight unit; obtaining a windows size of the backlight unit and a corresponding luminance dependency of windows size; obtaining, by the driving unit, a first display luminance corresponding to each area in the backlight unit according to a product of the area peak luminance of each area and the luminance dependency of windows size; and performing luminance compensation in each area of the backlight unit according to the first display luminance. A backlight compensation method that maintains optical quality is achieved, which can maintain brightness and gamma values under different windows sizes.

Abstract: An illumination assembly includes a substrate, a wiring structure, a reflecting layer and a plurality of light-emitting diodes. The wiring structure is formed on a part of the substrate, and includes a catalyst layer covering the part of the substrate, and a conducting layer formed on the catalyst layer. The reflecting layer is formed on another part of the substrate that is exposed from the wiring structure. The light-emitting diodes are disposed on the wiring structure and are electrically connected to the wiring structure.

Abstract: A light emitting device includes a heat sinking substrate, an electrically insulating layer partially formed on the heat sinking substrate, a circuit pattern layer formed on the electrically insulating layer, a light emitting diode (LED) chip, and an electrically insulating and thermally conductive interlayer. The LED chip is indirectly and non-electrically mounted to the heat sinking substrate. The electrically insulating and thermally conductive interlayer is interposed between the bottom portion of the LED chip and a portion of the heat sinking substrate exposed from the electrically insulating layer. A bottom portion of the LED chip bridges the electrically insulating and thermally conductive interlayer and the circuit pattern layer.

Abstract: An illumination assembly includes a substrate, a wiring structure, a reflecting layer and a plurality of light-emitting diodes. The wiring structure is formed on a part of the substrate, and includes a catalyst layer covering the part of the substrate, and a conducting layer formed on the catalyst layer. The reflecting layer is formed on another part of the substrate that is exposed from the wiring structure. The light-emitting diodes are disposed on the wiring structure and are electrically connected to the wiring structure.

Abstract: An illumination assembly includes a substrate, a wiring structure, a reflecting layer and a plurality of light-emitting diodes. The wiring structure is formed on a part of the substrate, and includes a catalyst layer covering the part of the substrate, and a conducting layer formed on the catalyst layer. The reflecting layer is formed on another part of the substrate that is exposed from the wiring structure. The light-emitting diodes are disposed on the wiring structure and are electrically connected to the wiring structure.

Abstract: A light emitting device includes a heat sinking substrate, an electrically insulating layer partially formed on the heat sinking substrate, a circuit pattern layer formed on the electrically insulating layer, a light emitting diode (LED) chip, and an electrically insulating and thermally conductive interlayer. The LED chip is indirectly and non-electrically mounted to the heat sinking substrate. The electrically insulating and thermally conductive interlayer is interposed between the bottom portion of the LED chip and a portion of the heat sinking substrate exposed from the electrically insulating layer. A bottom portion of the LED chip bridges the electrically insulating and thermally conductive interlayer and the circuit pattern layer.

Abstract: An illumination assembly includes a substrate, a wiring structure, a reflecting layer and a plurality of light-emitting diodes. The wiring structure is formed on a part of the substrate, and includes a catalyst layer covering the part of the substrate, and a conducting layer formed on the catalyst layer. The reflecting layer is formed on another part of the substrate that is exposed from the wiring structure. The light-emitting diodes are disposed on the wiring structure and are electrically connected to the wiring structure.

Abstract: An illumination assembly includes a substrate, a wiring structure, a reflecting layer and a plurality of light-emitting diodes. The wiring structure is formed on a part of the substrate, and includes a catalyst layer covering the part of the substrate, and a conducting layer formed on the catalyst layer. The reflecting layer is formed on another part of the substrate that is exposed from the wiring structure. The light-emitting diodes are disposed on the wiring structure and are electrically connected to the wiring structure.

Abstract: A method of making an electronic device includes: providing a base unit including a metal substrate, an insulating layer disposed on the metal substrate, and a first circuit unit disposed on the insulating layer; and laser ablating the first circuit unit, the insulating layer and the metal substrate in such a manner that a hole defined by a hole-defining wall is formed to expose the metal substrate, and that an interconnecting layer is formed on the hole-defining wall during laser ablation of the metal substrate.

Abstract: A light emitting device includes a heat sinking substrate, an electrically insulating layer, a circuit pattern layer, and at least one light emitting diode (LED) chip. The electrically insulating layer is partially formed on the heat sinking substrate so as to expose a portion of the heat sinking substrate. The circuit pattern layer is formed on the electrically insulating layer. The LED chip is electrically connected to the circuit pattern layer, and is indirectly and non-electrically mounted to the portion of the heat sinking substrate exposed from the electrically insulating layer and the circuit pattern layer. A method of making the light emitting device is also provided.

Abstract: A method of making an electronic device includes: providing a base unit including a metal substrate, an insulating layer disposed on the metal substrate, and a first circuit unit disposed on the insulating layer; and laser ablating the first circuit unit, the insulating layer and the metal substrate in such a manner that a hole defined by a hole-defining wall is formed to expose the metal substrate, and that an interconnecting layer is formed on the hole-defining wall during laser ablation of the metal substrate.

Abstract: An illumination assembly includes a substrate, a wiring structure, a reflecting layer and a plurality of light-emitting diodes. The wiring structure is formed on a part of the substrate, and includes a catalyst layer covering the part of the substrate, and a conducting layer formed on the catalyst layer. The reflecting layer is formed on another part of the substrate that is exposed from the wiring structure. The light-emitting diodes are disposed on the wiring structure and are electrically connected to the wiring structure.

Abstract: Disclosed are methods and compositions for preventing cerebrovascular function dysfunction in a patient who has been identified as an ApoE4 carrier. The disclosed methods and compositions include rapamycin, a rapamycin analog, or another such inhibitor of the target of rapamycin (TOR).

Abstract: Disclosed are methods and compositions for the treatment or prevention of vascular cognitive impairment. The disclosed methods and compositions include rapamycin, a rapamycin analog, or another such inhibitor of the target of rapamycin (TOR).

Abstract: Method and device for light signal reception. This device can selectively execute a comparison mode or a gain mode. In the device, a transmitter transmits a light beam to a target. A receiver receives the light beam reflected from the target and outputs a corresponding received signal. In the comparison mode, it is determined whether a pulse in the received signal is higher than a reference voltage level. When the pulse is higher the reference voltage level, the pulse is outputted. The gain mode is executed and the received signal is amplified and output when no pulse is higher than the reference voltage level in the received signal. The method and device of the present invention can be applied to range finders, the comparison mode is executed during short-distance measurement and the gain mode is executed during long-distance measurement thereby measuring the target distance from several meters to a thousand meters.

Abstract: A Rangefinder capable of long and short distance measurement in company with compass measurement. The rangefinder includes distance measurement unit, a compass sensing unit and a processor. The rangefinder can selectively execute a comparison mode or a gain mode. The comparison mode is executed during short-distance measurement and the gain mode is executed during long-distance measurement. The compass measurement unit senses a terrestrial magnetism to obtain first and second magnetic sensing signals. The processor estimates a distance between the target and the rangefinder according to the measurement signal from the distance measurement unit and determines a compass orientation of the target according to the first and second magnetic sensing signals.

Abstract: A method of measuring the azimuth and resetting to zero azimuth automatically is disclosed. Multiple azimuths in longitudinal and latitudinal orientations are sampled by two orthogonal magnetic sensors installed in an azimuth meter, and then are output by corresponding first and second sine wave signals. These two sine wave signals are normalized by adjusting them to be of equal amplitude. The maximum and minimum values of the normalized sine wave signals are used to compute the average values of the respective normalized sine wave signals being of equal amplitude on the positive and negative sides. The resultant sine wave signals serve as the zero reference values for comparison with subsequently taken measuring signals to yield the actual azimuth. The numerical computation for the azimuth can be performed by a microprocessor with accuracy and high speed.

Abstract: A method of measuring the azimuth and resetting to zero azimuth automatically is disclosed. Multiple azimuths in longitudinal and latitudinal orientations are sampled by two orthogonal magnetic sensors installed in an azimuth meter, and then are output by corresponding first and second sine wave signals. These two sine wave signals are normalized by adjusting them to be of equal amplitude. The maximum and minimum values of the normalized sine wave signals are used to compute the average values of the respective normalized sine wave signals being of equal amplitude on the positive and negative sides. The resultant sine wave signals serve as the zero reference values for comparison with subsequently taken measuring signals to yield the actual azimuth. The numerical computation for the azimuth can be performed by a microprocessor with accuracy and high speed.

Abstract: A Rangefinder capable of long and short distance measurement in company with compass measurement. The rangefinder includes distance measurement unit, a compass sensing unit and a processor. The rangefinder can selectively execute a comparison mode or a gain mode. The comparison mode is executed during short-distance measurement and the gain mode is executed during long-distance measurement. The compass measurement unit senses a terrestrial magnetism to obtain first and second magnetic sensing signals. The processor estimates a distance between the target and the rangefinder according to the measurement signal from the distance measurement unit and determines a compass orientation of the target according to the first and second magnetic sensing signals.