Patents by Inventor Ai Ling Low

Ai Ling Low has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ELECTRONIC DEVICE
    Publication number: 20080113502
    Abstract: An electronic device includes a first die that includes wires for bonding, a second die that includes an array of balls for bonding, and a substrate. The substrate includes bond sites for wires from the first die, and bond sites for the array of balls from the second die. The wires of first die are coupled to the bond sites for wires of the substrate. The balls of the second die are coupled to the bond sites for the array of balls of the substrate.
    Type: Application
    Filed: January 15, 2008
    Publication date: May 15, 2008
    Inventors: Ai Ling Low, Dejen Eshete
  • Electronic device
    Patent number: 7332801
    Abstract: An electronic device includes a first die that includes wires for bonding, a second die that includes an array of balls for bonding, and a substrate. The substrate includes bond sites for wires from the first die, and bond sites for the array of balls from the second die. The wires of first die are coupled to the bond sites for wires of the substrate. The balls of the second die are coupled to the bond sites for the array of balls of the substrate.
    Type: Grant
    Filed: September 30, 2004
    Date of Patent: February 19, 2008
    Assignee: Intel Corporation
    Inventors: Ai Ling Low, Dejen Eshete