Patents by Inventor Ai Min Tan

Ai Min Tan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • System and method for an electronic package with a fail-open mechanism
    Patent number: 8816390
    Abstract: In accordance with an embodiment, a semiconductor package includes a first surface configured to be mounted on a circuit board, and a region of thermally expandable material configured to push the first surface of the semiconductor package away from the circuit board when a temperature of the thermally expandable material exceeds a first temperature.
    Type: Grant
    Filed: January 30, 2012
    Date of Patent: August 26, 2014
    Assignee: Infineon Technologies AG
    Inventors: Carlo Baterna Marbella, Ganesh Vetrivel Periasamy, Kok Kiat Koo, Ai Min Tan
  • SYSTEM AND METHOD FOR AN ELECTRONIC PACKAGE WITH A FAIL-OPEN MECHANISM
    Publication number: 20130194752
    Abstract: In accordance with an embodiment, a semiconductor package includes a first surface configured to be mounted on a circuit board, and a region of thermally expandable material configured to push the first surface of the semiconductor package away from the circuit board when a temperature of the thermally expandable material exceeds a first temperature.
    Type: Application
    Filed: January 30, 2012
    Publication date: August 1, 2013
    Applicant: Infineon Technologies AG
    Inventors: Carlo Baterna Marbella, Ganesh Vetrivel Periasamy, Kok Kiat Koo, Ai Min Tan
  • Magnetically alignable integrated circuit device
    Patent number: 7994608
    Abstract: An integrated circuit device includes a semiconductor chip having an active surface with a plurality of chip contact pads, a rewiring substrate and an electrically conductive inductor coil for magnetically aligning the semiconductor chip with the rewiring substrate.
    Type: Grant
    Filed: August 24, 2005
    Date of Patent: August 9, 2011
    Assignee: Infineon Technologies AG
    Inventors: Ai Min Tan, Gerald Ofner, Swain Hong Yeo, Mary Teo, Pei Siang Lim
  • Semiconductor chip with flip chip contacts and a passivation layer with varying thickness portions surrounding contact surfaces of the semiconductor chip
    Patent number: 7768137
    Abstract: A semiconductor chip includes flip chip contacts that are arranged on contact surfaces of an active top side of the semiconductor chip. The contact surfaces are surrounded by a passivation layer that covers the active top side while leaving exposed the contact surfaces. The passivation layer includes thickened portions that surround the contact surfaces. The semiconductor chip formed with thickened portions around the contact surfaces is protected from delamination during packaging of the semiconductor chip to form a semiconductor device.
    Type: Grant
    Filed: May 8, 2006
    Date of Patent: August 3, 2010
    Assignee: Infineon Technologies AG
    Inventors: Gerald Ofner, Ai Min Tan, Mary Teo
  • Magnetically Alignable Integrated Circuit Device
    Publication number: 20080265367
    Abstract: An integrated circuit device includes a semiconductor chip having an active surface with a plurality of chip contact pads, a rewiring substrate and an electrically conductive inductor coil for magnetically aligning the semiconductor chip with the rewiring substrate.
    Type: Application
    Filed: August 24, 2005
    Publication date: October 30, 2008
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Ai Min Tan, Gerald Ofner, Swain Hong Yeo, Mary Teo, Pei Siang Lim
  • Method and structure for heatspreader attachment in high thermal performance IC packages
    Patent number: 6351032
    Abstract: Improved structures for and methods for assembling heatspreader attachments in integrated circuit packages permit attachment of a relatively low cost heatspreader having a high coefficient of thermal expansion directly to the back of a die while maximizing thermal performance, mechanical integrity and reliability of the assembly. The improvements are realized through the use of specific adhesive materials to attach the heatspreader to the die, heatspreader geometries, adhesive geometries, assembly techniques and underfill geometries.
    Type: Grant
    Filed: January 20, 2000
    Date of Patent: February 26, 2002
    Assignee: National Semiconductor Corporation
    Inventors: Bernard K H Lee, Ben T C Tan, Emillo F. Mallare, Jr., Sarvotham M. Bhandarkar, Subodh Mhaisalkar, Ai Min Tan