Abstract: The object of the present invention is to provide a hot melt adhesive which is less likely to cause stringing, and has excellent thermal stability and adhesion, in particular adhesion to a paper material. The present invention relates to a hot melt adhesive comprising: (A) an olefin-based polymer, (B) a butyral resin, (C) at least one selected from the group consisting of a fatty acid and a derivative thereof, and (D) a tackifier resin.

Abstract: There are provided a hot-melt adhesive, which is excellent in solvent resistance and is excellent in adhesion to an adherend (specifically, a polyimide film) containing an electrolytic solution of a battery therein, and also can contribute to an improvement in performances of electric instruments; and an electric instrument produced by using such hot-melt adhesive. A hot-melt adhesive for electric instruments, comprising an olefin based modified polymer (A), the olefin based modified polymer (A) being a modified polymer having a functional group containing silicon, is excellent in resistance to an electrolytic solution of a battery (that is, electrolytic solution resistance or solvent resistance), and also exhibits improved adhesion of the hot-melt adhesive to an adherend (plastic film such as a polyimide film) containing the electrolytic solution therein.

Abstract: The object of the present invention is to provide a hot melt adhesive which is less likely to cause stringing and has excellent thermal stability, and further has excellent adhesion, in particular adhesion to a paper substrate. The present invention relates to a hot melt adhesive comprising: (A) a polar functional group-modified polymer, (B) a butyral resin, (C) an olefin-based polymer, and (D) a tackifier resin.

Abstract: An object of the present invention is to provide a hot melt adhesive being environmentally-friendly, having excellent adhesion property to various substrates such as paper substrate and polyolefin substrate, as well having excellent thermal stability. The present invention relates to a hot melt adhesive comprising: (A) a polar functional group-modified polymer, (B) an aliphatic polyester-based resin, (C) an olefin-based polymer, and (D) a tackifier resin.

Abstract: Disclosed is a hot melt adhesive comprising: (A) an ethylene-based copolymer; (B) a polyester polyol; and (C) a wax, wherein the wax (C) includes both (C1) a Fischer-Tropsch wax and (C2) a petroleum wax. The hot melt adhesive can be applied at a low temperature, and also has a suitably long open time and is excellent in adhesion to a paper. The hot melt adhesive can be used preferably for producing a paper product. A paper product obtainable by using the hot melt adhesive is also provided.

Abstract: Disclosed is a hot melt adhesive comprising: (A) a copolymer of ethylene/olefin having 3-20 carbons; and (B) a polyester polyol. The hot melt adhesive can be applied at low temperature and has a suitably long open time. Particularly, the hot melt adhesive is excellent in adhesion to a paper and is useful as a hot melt adhesive for papers.

Abstract: There are provided a hot-melt adhesive, which is excellent in solvent resistance and is excellent in adhesion to an adherend (specifically, a polyimide film) containing an electrolytic solution of a battery therein, and also can contribute to an improvement in performances of electric instruments; and an electric instrument produced by using such hot-melt adhesive. A hot-melt adhesive for electric instruments, comprising an olefin based modified polymer (A), the olefin based modified polymer (A) being a modified polymer having a functional group containing silicon, is excellent in resistance to an electrolytic solution of a battery (that is, electrolytic solution resistance or solvent resistance), and also exhibits improved adhesion of the hot-melt adhesive to an adherend (plastic film such as a polyimide film) containing the electrolytic solution therein.

Abstract: An adhesive sheet comprising a hot-melt adhesive layer. The hot-melt type adhesive layer comprises a modified polymer (A) to which a cross-linkable group is bonded and a polyolefin (B). The adhesive sheet can adhere to various adherends and the adhesive becomes less likely to squeeze out from an adherend in thermal fusion bonding and sealing of the adherend. In a laminate comprising the adhesive sheet the adhesive layer does not squeeze out from the adherend without being affected by the material of the adherend.

Abstract: The present invention provides a hot melt adhesive which is applicable at a low temperature, is excellent in heat resistance and shows a suitable long open time. Moreover, the present invention provides a paper product produced by using the hot melt adhesive. The present hot melt adhesive comprising (A) an ethylene-based copolymer and (B) a wax, wherein (B) the wax comprises (B1) a carboxylic acid or carboxylic acid anhydride-modified olefin copolymer wax, is applicable at a low temperature, is excellent in heat resistance and shows a suitable long open time. Furthermore, a paper product produced by using the present hot melt adhesive is provided.

Abstract: The present invention provides a hot melt adhesive which is less likely to cause stringing, is excellent in heat resistance and thermal stability, and has excellent adhesive strength in a wide temperature range. Moreover, the present invention provides a paper product produced by using the hot melt adhesive. Disclosed is a hot melt adhesive comprising (A) a copolymer of ethylene/olefin having 3-20 carbons and (B) a copolymer of ethylene/carboxylic acid ester, wherein the amount of the copolymer of ethylene/carboxylic acid ester (B) is from 13 to 35 parts by weight based on 100 parts by weight in total of the components (A) and (B). The hot melt adhesive is preferable when the copolymer of ethylene/olefin having 3-20 carbons (A) includes (A1) a copolymer of ethylene with octene, and the copolymer of ethylene/carboxylic acid ester (B) includes (B1) a copolymer of ethylene with methyl methacrylate.

Abstract: Provided is a moisture-curing hot melt adhesive, which has superior overall performance, including heat resistance, adhesiveness, and solidification performance, and with which there is no reduction in the resulting IC card quality or productivity. Also provided is an IC card obtained by applying such a moisture-curing hot melt adhesive. The moisture-curing hot melt adhesive for an IC card comprises a urethane prepolymer (A) having a chemical structure (A1) derived from a polyester polyol (a1) that has isocyanate groups at the terminals and that is obtained by reacting of a diol and a dicarboxylic acid having 10 carbons or fewer. The moisture-curing hot melt adhesive has a shear modulus with non-moisture curing that is between (1×104) and (1×108) Pa at 40° C. and between (1×100) and (1×104) at 80° C. An IC card can be ideally produced by bonding a decorative material and a substrate using the moisture-curing hot melt adhesive.