Patents by Inventor Ai Tan

Ai Tan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor chip with flip chip contacts, and method for producing semiconductor chip with flip chip contacts
    Publication number: 20060270163
    Abstract: A semiconductor chip includes flip chip contacts that are arranged on contact surfaces of an active top side of the semiconductor chip. The contact surfaces are surrounded by a passivation layer that covers the active top side while leaving exposed the contact surfaces. The passivation layer includes thickened portions that surround the contact surfaces. The semiconductor chip formed with thickened portions around the contact surfaces is protected from delamination during packaging of the semiconductor chip to form a semiconductor device.
    Type: Application
    Filed: May 8, 2006
    Publication date: November 30, 2006
    Inventors: Gerald Ofner, Ai Tan, Mary Teo
  • Attachment of flip chips to substrates
    Publication number: 20060115927
    Abstract: An anisotropic conductive layer is formed between a substrate and a flip chip having multiple contacts. Insulating layers are formed on the lateral surfaces of the electrical contacts. When the flip chip is attached to a substrate, the insulating layers reduce the chance of an electrical path being formed in the lateral direction between the contacts.
    Type: Application
    Filed: November 29, 2002
    Publication date: June 1, 2006
    Applicant: Infineon Technologies AG
    Inventors: Swain Yeo, Ai Tan