Patents by Inventor Ai-Tsung Li
Ai-Tsung Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11914436Abstract: An example system can include a noise sensor communicatively coupled to a controller of a computing device to dynamically determine a sound pressure level (SPL) of an environment in which the computing device is present. The computing device can include a cooling fan and the controller comprising a processor in communication with a memory resource including instructions executable to dynamically determine a threshold speed of the cooling fan based on the determined SPL of the environment set a speed of the cooling fan based on the determined threshold speed.Type: GrantFiled: September 4, 2019Date of Patent: February 27, 2024Assignee: Hewlett-Packard Development Company, L.P.Inventors: Hung-Wen Chang, Ai-Tsung Li, Shih-Han Chen
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Publication number: 20220386506Abstract: Example implementations relate to heat-sink chambers. For instance, in an example a heat-sink can include a body including a first surface and a second surface, where the body defines: a chamber that extends from the first surface through a portion of a total thickness of the body; an opening in the second surface; and a channel that extends from the chamber through a remaining portion of the total thickness of the body to the opening to couple the chamber to the opening.Type: ApplicationFiled: November 14, 2019Publication date: December 1, 2022Applicant: Hewlett-Packard Development Company, L.P.Inventors: Hao-Wu Yang, Ai-Tsung Li, Hung-Wen Chang, Chien-Tu Cheng
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Publication number: 20220221917Abstract: Examples of a chassis component are described herein. In an example, the chassis component can have a recess having a mesh structure and a working fluid disposed therein. A conductive cover can seal the recess with the mesh structure and the working fluid therein.Type: ApplicationFiled: September 19, 2019Publication date: July 14, 2022Applicant: Hewlett-Packard Development Company, L.P.Inventors: Hung-Wen Chang, Ai-Tsung Li, Hao-Wu Yang, Chien-Tu Cheng, Shih-Han Chen
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Publication number: 20220187882Abstract: An example system can include a noise sensor communicatively coupled to a controller of a computing device to dynamically determine a sound pressure level (SPL) of an environment in which the computing device is present. The computing device can include a cooling fan and the controller comprising a processor in communication with a memory resource including instructions executable to dynamically determine a threshold speed of the cooling fan based on the determined SPL of the environment set a speed of the cooling fan based on the determined threshold speed.Type: ApplicationFiled: September 4, 2019Publication date: June 16, 2022Applicant: Hewlett-Packard Development Company, L.P.Inventors: Hung-Wen Chang, Ai-Tsung Li, Shih-Han Chen
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Patent number: 11306731Abstract: Examples herein relate to fan bodies with pressure regulating chambers. For instance, in some examples a fan body can define an outlet, an inlet, a fan chamber that is in fluidic communication with the inlet and the outlet, and a hollow pressure regulating chamber having an opening that is in fluidic communication with the fan chamber.Type: GrantFiled: September 3, 2020Date of Patent: April 19, 2022Assignee: Hewlett-Packard Development Company, L.P.Inventors: Shih-Han Chen, Hung-Wen Chang, Ai-Tsung Li
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Patent number: 11293457Abstract: In example implementations, an apparatus is provided. The apparatus includes an accelerometer, a plurality of fan blades, a coil magnet and a processor. The accelerometer is coupled to a motor to measure an amount of vibration. The plurality of fan blades is coupled to the motor. Each one of the plurality of fan blades comprises a magnet. The coil magnet is coupled to a fan housing that encloses the motor, the plurality of fan blades and the accelerometer. The processor is communicatively coupled to the motor, the accelerometer, and the coil magnet. The processor activates the coil magnet to control a balance of the plurality of fan blades in response to an amount of vibration measured by the accelerometer that exceeds a threshold.Type: GrantFiled: January 19, 2018Date of Patent: April 5, 2022Assignee: Hewlett-Packard Development Company, L.P.Inventors: Ai-Tsung Li, Chao-Wen Cheng
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Publication number: 20220065264Abstract: Examples herein relate to fan bodies with pressure regulating chambers. For instance, in some examples a fan body can define an outlet, an inlet, a fan chamber that is in fluidic communication with the inlet and the outlet, and a hollow pressure regulating chamber having an opening that is in fluidic communication with the fan chamber.Type: ApplicationFiled: September 3, 2020Publication date: March 3, 2022Inventors: Shih-Han Chen, Hung-Wen Chang, Ai-Tsung Li
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Patent number: 11259423Abstract: Example implementations relate to multilayer housings. In one example, multilayer housing can include a first continuous layer comprising copper, plastic, graphene, aluminum, titanium, magnesium, or combinations thereof, a void layer on the first continuous layer, wherein the void layer comprises from (5) volume percent (vol. %) to (95) vol. % voids; and a second continuous layer on the void layer, wherein the second continuous layer comprises copper, plastic, graphene, aluminum, titanium, magnesium, or combinations thereof.Type: GrantFiled: October 3, 2016Date of Patent: February 22, 2022Assignee: Hewlett-Packard Development Company, L.P.Inventors: Kuan-Ting Wu, Kevin Voss, Ai-Tsung Li, Wei Kuang Chu, Wei-Chung Chen
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Publication number: 20210136938Abstract: Example implementations relate to multilayer housings. In one example, multilayer housing can include a first continuous layer comprising copper, plastic, graphene, aluminum, titanium, magnesium, or combinations thereof, a void layer on the first continuous layer, wherein the void layer comprises from (5) volume percent (vol. %) to (95) vol. % voids; and a second continuous layer on the void layer, wherein the second continuous layer comprises copper, plastic, graphene, aluminum, titanium, magnesium, or combinations thereof.Type: ApplicationFiled: October 3, 2016Publication date: May 6, 2021Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.Inventors: Kuan-Ting WU, Kevin VOSS, AI-Tsung LI, Wei Kuang CHU, Wei-Chung CHEN
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Publication number: 20200340496Abstract: In example implementations, an apparatus is provided. The apparatus includes an accelerometer, a plurality of fan blades, a coil magnet and a processor. The accelerometer is coupled to a motor to measure an amount of vibration. The plurality of fan blades is coupled to the motor. Each one of the plurality of fan blades comprises a magnet. The coil magnet is coupled to a fan housing that encloses the motor, the plurality of fan blades and the accelerometer. The processor is communicatively coupled to the motor, the accelerometer, and the coil magnet. The processor activates the coil magnet to control a balance of the plurality of fan blades in response to an amount of vibration measured by the accelerometer that exceeds a threshold.Type: ApplicationFiled: January 19, 2018Publication date: October 29, 2020Inventors: AI-TSUNG LI, CHAO-WEN CHENG
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Patent number: 10642324Abstract: Examples of a cover for a device are described herein. The cover includes a substrate to be placed in proximity of a heat source of a device. In an example, a heat resistant layer is applied over a surface of the substrate to insulate heat generated by the heat source. Further, a top layer is applied over one of the heat resistant layer and another surface of the substrate, which is opposite to the surface having the heat resistant layer. The top layer provides at least one of chemical resistant properties and aesthetic properties.Type: GrantFiled: April 6, 2016Date of Patent: May 5, 2020Assignee: Hewlett-Packard Development Company, L.P.Inventors: Kuan-Ting Wu, Ai-Tsung Li, Ya-Ting Yeh, Kevin Voss, Michael Delpier
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Publication number: 20190025895Abstract: Examples of a cover for a device are described herein. The cover includes a substrate to be placed in proximity of a heat source of a device. In an example, a heat resistant layer is applied over a surface of the substrate to insulate heat generated by the heat source. Further, a top layer is applied over one of the heat resistant layer and another surface of the substrate, which is opposite to the surface having the heat resistant layer. The top layer provides at least one of chemical resistant properties and aesthetic properties.Type: ApplicationFiled: April 6, 2016Publication date: January 24, 2019Inventors: KUAN-TING WU, AI-TSUNG LI, YA-TING YEH, KEVIN VOSS, MICHAEL DELPIER
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Patent number: 9092204Abstract: A portable electrical device with heat dissipation mechanism includes a housing with an acoustic hole, an earphone receptacle with a earphone hole, and two fans. The earphone receptacle and the fans are disposed in the housing. The fans are respectively located adjacent to the acoustic hole and the earphone hole, and generate airflow passing through the acoustic hole and the earphone hole. Thus, the portable electrical device dissipating heat utilizes the holes existing on the housing, without additional heat-dissipation holes.Type: GrantFiled: November 19, 2013Date of Patent: July 28, 2015Assignee: Wistron Corp.Inventors: Wei-Cheng Chou, Ming-Chih Chen, Ai-Tsung Li
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Publication number: 20150018053Abstract: A portable electrical device with heat dissipation mechanism includes a housing with an acoustic hole, an earphone receptacle with a earphone hole, and two fans. The earphone receptacle and the fans are disposed in the housing. The fans are respectively located adjacent to the acoustic hole and the earphone hole, and generate airflow passing through the acoustic hole and the earphone hole. Thus, the portable electrical device dissipating heat utilizes the holes existing on the housing, without additional heat-dissipation holes.Type: ApplicationFiled: November 19, 2013Publication date: January 15, 2015Applicant: WISTRON CORP.Inventors: Wei-Cheng Chou, Ming-Chih Chen, Ai-Tsung Li