Abstract: Embodiments of the present disclosure provide a chuck structure of a semiconductor cleaning apparatus and a semiconductor cleaning apparatus. The chuck structure includes a chuck base, a gas inlet control device, and a first gas channel and a second gas channel arranged in the chuck base and both configured to spray a gas toward the to-be-processed workpiece. A gas spray direction of the first gas channel is inclined toward the outside of the surface of the to-be-processed workpiece that is opposite to the chuck base. A gas spray direction of the second gas channel is perpendicular to the surface of the to-be-processed workpiece that is opposite to the chuck base. The gas inlet control device is configured to selectively supply the gas to at least one of the first gas channel and the second gas channel to cause the to-be-processed workpiece to be able to float at different height positions.

Abstract: The present disclosure provides a wafer chuck in semiconductor cleaning equipment, including a chuck base, a jetting assembly arranged on the chuck base, and a plurality of wafer lifting shafts arranged on the chuck base. The chuck base includes a carrier surface for supporting the wafer. The gas outlet of the jetting assembly is located in the center area of the carrier surface and configured to jet gas between the carrier surface and the wafer. The plurality of wafer lifting shafts are distributed around the gas outlet of the jetting assembly along the circumference of the carrier surface. Each wafer lifting shaft of the plurality of wafer lifting shafts is movable relative to the chuck base, and each wafer lifting shaft includes an inclined platform. The inclined platform includes an inclined extension surface. The inclined extension surface is configured to carry the wafer at the edge of the wafer.

Abstract: The present disclosure provides a wafer chuck in semiconductor cleaning equipment, including a chuck base, a jetting assembly arranged on the chuck base, and a plurality of wafer lifting shafts arranged on the chuck base. The chuck base includes a carrier surface for supporting the wafer. The gas outlet of the jetting assembly is located in the center area of the carrier surface and configured to jet gas between the carrier surface and the wafer. The plurality of wafer lifting shafts are distributed around the gas outlet of the jetting assembly along the circumference of the carrier surface. Each wafer lifting shaft of the plurality of wafer lifting shafts is movable relative to the chuck base, and each wafer lifting shaft includes an inclined platform. The inclined platform includes an inclined extension surface. The inclined extension surface is configured to carry the wafer at the edge of the wafer.

Abstract: Embodiments of the present disclosure provide a chuck structure of a semiconductor cleaning apparatus and a semiconductor cleaning apparatus. The chuck structure includes a chuck base, a gas inlet control device, and a first gas channel and a second gas channel arranged in the chuck base and both configured to spray a gas toward the to-be-processed workpiece. A gas spray direction of the first gas channel is inclined toward the outside of the surface of the to-be-processed workpiece that is opposite to the chuck base. A gas spray direction of the second gas channel is perpendicular to the surface of the to-be-processed workpiece that is opposite to the chuck base. The gas inlet control device is configured to selectively supply the gas to at least one of the first gas channel and the second gas channel to cause the to-be-processed workpiece to be able to float at different height positions over the chuck base.

Abstract: The present disclosure provides a cleaning chamber and a cleaning apparatus, including a chamber body and a carrying device and a spray device arranged in the chamber body. The carrying device is configured to carry the to-be-cleaned object. The spray device is arranged above and around the carrying device and configured to spray a cleaning fluid to the to-be-cleaned object. With the cleaning chamber and the cleaning apparatus provided by the present disclosure, the usage of the cleaning fluid may be reduced to reduce the cleaning cost.