Patents by Inventor Aida Abaca

Aida Abaca has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR PACKAGE WITH INTEGRATED DIE PADDLES FOR POWER STAGE
    Publication number: 20170117213
    Abstract: In one implementation, a semiconductor package includes a first conductive carrier including a first die paddle of the semiconductor package, and a control transistor having a drain attached to the first die paddle. The semiconductor package also includes a second conductive carrier attached to the first conductive carrier and including a second die paddle of the semiconductor package, and a sync transistor having a drain attached to the second die paddle. The second die paddle couples a source of the control transistor to the drain of the sync transistor.
    Type: Application
    Filed: January 4, 2017
    Publication date: April 27, 2017
    Inventors: Eung San Cho, Aida Abaca, Jobel A. Guanzon
  • Semiconductor package with integrated die paddles for power stage
    Patent number: 9564389
    Abstract: In one implementation, a semiconductor package includes a first conductive carrier including a first die paddle of the semiconductor package, and a control transistor having a drain attached to the first die paddle. The semiconductor package also includes a second conductive carrier attached to the first conductive carrier and including a second die paddle of the semiconductor package, and a sync transistor having a drain attached to the second die paddle. The second die paddle couples a source of the control transistor to the drain of the sync transistor.
    Type: Grant
    Filed: February 25, 2015
    Date of Patent: February 7, 2017
    Assignee: Infineon Technologies Americas Corp.
    Inventors: Eung San Cho, Aida Abaca, Jobel A. Guanzon
  • Semiconductor Package with Integrated Die Paddles for Power Stage
    Publication number: 20150270202
    Abstract: In one implementation, a semiconductor package includes a first conductive carrier including a first die paddle of the semiconductor package, and a control transistor having a drain attached to the first die paddle. The semiconductor package also includes a second conductive carrier attached to the first conductive carrier and including a second die paddle of the semiconductor package, and a sync transistor having a drain attached to the second die paddle. The second die paddle couples a source of the control transistor to the drain of the sync transistor.
    Type: Application
    Filed: February 25, 2015
    Publication date: September 24, 2015
    Inventors: Eung San Cho, Aida Abaca, Jobel A. Guanzon