Abstract: There is provided a method performed by a computing device for processing data objects in a cloud-based system. The method includes generating a group of different hardware security module, HSM, master keys shared by a plurality of identical HSMs, and receiving a request from a customer application, wherein the request comprises one or more data objects and an encrypted version of a customer working key. The method further includes associating the received request with a unique HSM master key from the group of different HSM master keys, decrypting the encrypted version of the customer working key and encrypting the customer working key using the unique HSM master key. The method further comprises sending the one or more data objects with the encrypted customer working key using the unique HSM master key to a randomly selected HSM from the plurality of identical HSMs.

Abstract: A test system (1) has a test controller (2) and at least one probe (3). An ICC card (C) is inserted into a slot (8) of the probe (3), and a card-simulating interface (5) of the probe (3) is inserted in the slot (S) of the terminal (T) under test. The test controller (2) communicates bi-directionally with the terminal (T) and an external transaction processing system (B). Up to six data monitoring points (100 to 105) are possible, different numbers of points providing different modes of operation.

Abstract: A method of dicing a wafer into a plurality of dies is disclosed. The wafer comprises a substrate having a surface on which at least one thin film layer is formed. The method comprises the steps of laser cutting a plurality of lines in the wafer to at least the depth of the at least one thin film layer; and saw cutting along the plurality of lines in the wafer to dice the wafer.