Abstract: A pick-and-place assembly tool, system and method comprising a flexible array of gripper heads is adapted to pick a sheet of flexible material or a pre-assembled array of flexibly coupled elements from a flat surface and place it on a convex, doubly curved surface. Gripping action may be provided by a suction force. When picking the pre-assembled array of elements, the array of gripper heads may conform to the flat surface. The assembly tool may then be moved above and aligned to the compound curved placing surface. When lowered onto the receiving surface, the assembly tool passively may precisely conform to the convex surface. Distortion of the material or array may be controlled by flexible couplers disposed between the gripper heads. Heating elements disposed on some or all of the gripper heads may be used to tack the workpiece in place to maintain registration during subsequent processing, e.g., lamination.