Patents by Inventor Aihua Li

Aihua Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10194547
    Abstract: The present disclosure provides an electronic product metal shell with an antenna groove and a method of manufacturing the same. The electronic product metal shell includes a metal layer, a hard anodic oxidation layer, a step recess, an antenna groove and a non-conductive material filled in the antenna groove. The metal layer may have a first surface and a second surface. The hard anodic oxidation layer may be coated on the first surface and the second surface of the metal layer. The step recess may be formed through the hard anodic oxidation layer on the first surface of the metal layer and partially into the metal layer. The antenna groove may be formed within the step recess extending through the metal layer to expose an inner side of the hard anodic oxidation layer on the second surface of the metal layer.
    Type: Grant
    Filed: June 23, 2017
    Date of Patent: January 29, 2019
    Assignee: BYD Company Limited
    Inventors: Baorong Jiang, Chongchong Liao, Aihua Li, Liang Chen
  • Publication number: 20180375733
    Abstract: A control method for application feature rules is provided. In the method, an application feature server preprocesses one or more application feature fields of a third-party application; and the application feature server provides the one or more preprocessed application feature fields and a corresponding application Identifier (ID) for an Application Detection Control (ADC) as an application feature rule.
    Type: Application
    Filed: March 23, 2016
    Publication date: December 27, 2018
    Applicant: ZTE Corporation
    Inventors: Xiaoyun ZHOU, Hai JIN, Weibin WANG, Jiannan CAI, Jianxun ZUO, Aihua LI, Hongbo CAI
  • Publication number: 20170295267
    Abstract: The present disclosure provides an electronic product metal shell and a method of manufacturing the same. The electronic product metal shell includes: a metal layer; a first hard anodic oxidation layer formed on an upper surface of the metal layer; a second hard anodic oxidation layer formed on a lower surface of the metal layer; an antenna groove penetrating through the metal layer and the first hard anodic oxidation layer; and a non-conductive material filled in the antenna groove.
    Type: Application
    Filed: June 23, 2017
    Publication date: October 12, 2017
    Inventors: BAORONG JIANG, CHONGCHONG LIAO, AIHUA LI, LIANG CHEN
  • Publication number: 20170288720
    Abstract: The present disclosure provides an electronic product metal shell with an antenna groove and a method of manufacturing the same. The electronic product metal shell includes a metal layer, a hard anodic oxidation layer, a step recess, an antenna groove and a non-conductive material filled in the antenna groove. The metal layer may have a first surface and a second surface. The hard anodic oxidation layer may be coated on the first surface and the second surface of the metal layer. The step recess may be formed through the hard anodic oxidation layer on the first surface of the metal layer and partially into the metal layer. The antenna groove may be formed within the step recess extending through the metal layer to expose an inner side of the hard anodic oxidation layer on the second surface of the metal layer.
    Type: Application
    Filed: June 23, 2017
    Publication date: October 5, 2017
    Inventors: BAORONG JIANG, CHONGCHONG LIAO, AIHUA LI, LIANG CHEN
  • Publication number: 20150044436
    Abstract: A method of preparing a metal composite material comprises: providing a metal substrate having an anodic oxidation layer on a surface thereof; forming a first dyed layer on the anodic oxidation layer; forming a second dyed layer on the first dyed layer; and removing at least a part of the second dyed layer. A metal composite material is also provided.
    Type: Application
    Filed: March 1, 2013
    Publication date: February 12, 2015
    Inventor: Aihua Li
  • Patent number: 8147671
    Abstract: A method for electroplating a substrate having an aluminum alloy surface comprises: applying a zinc layer onto the aluminum alloy surface; electroplating a first copper layer onto the zinc layer from an alkaline copper electroplating solution; electroplating a second copper layer onto the first copper layer from an acid copper electroplating solution; electroplating a Cu—Sn alloy layer onto the second copper layer from a Cu—Sn electroplating solution; and electroplating a chromium layer onto the Cu—Sn alloy layer from a trivalent chromium solution. The alkaline copper electroplating solution is substantially free of cyanide ion.
    Type: Grant
    Filed: November 23, 2009
    Date of Patent: April 3, 2012
    Assignee: BYD Co. Ltd.
    Inventors: Jipeng Sun, Aihua Li, Zaichun Li, Bo Peng
  • Publication number: 20120015172
    Abstract: The present invention discloses a composite material comprising: a substrate with an anodic oxide film layer having micropores; and at least one kind of dye filled in the micropores, wherein amount of the same kind of dye is gradient distribution on at least part of the substrate. The composite material has an even, metal gloss, uneasily scratched and wore out surface with gradually changed color. Moreover, the present invention also provided a method of preparing the same.
    Type: Application
    Filed: January 6, 2010
    Publication date: January 19, 2012
    Applicant: BYD Company Limited
    Inventors: Chunnan Gao, Ping Lu, Aihua Li, Liang Chen
  • Publication number: 20100167085
    Abstract: A method for electroplating a substrate having an aluminum alloy surface comprises: applying a zinc layer onto the aluminum alloy surface; electroplating a first copper layer onto the zinc layer from an alkaline copper electroplating solution; electroplating a second copper layer onto the first copper layer from an acid copper electroplating solution; electroplating a Cu—Sn alloy layer onto the second copper layer from a Cu—Sn electroplating solution; and electroplating a chromium layer onto the Cu—Sn alloy layer from a trivalent chromium solution. The alkaline copper electroplating solution is substantially free of cyanide ion.
    Type: Application
    Filed: November 23, 2009
    Publication date: July 1, 2010
    Applicant: BYD CO. LTD.
    Inventors: Jipeng Sun, Aihua Li, Zaichun Li, Bo Peng