Patents by Inventor Aik Kwang Ng

Aik Kwang Ng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Bicycle component mounting structure
    Patent number: 7757582
    Abstract: A bicycle component includes a band and a band tightener. The band is configured to at least partially extend around a bicycle frame portion. The band tightener is coupled to the band to tighten the band on the bicycle frame portion such that a portion of the band tightener contacts the bicycle frame portion with the band tightened on the bicycle frame portion.
    Type: Grant
    Filed: December 20, 2006
    Date of Patent: July 20, 2010
    Assignee: Shimano (Singapore) Pte., Ltd.
    Inventors: Wei Hock Kua, Aik Kwang Ng
  • Bicycle component mounting structure
    Publication number: 20080148899
    Abstract: A bicycle component includes a band and a band tightener. The band is configured to at least partially extend around a bicycle frame portion. The band tightener is coupled to the band to tighten the band on the bicycle frame portion such that a portion of the band tightener contacts the bicycle frame portion with the band tightened on the bicycle frame portion.
    Type: Application
    Filed: December 20, 2006
    Publication date: June 26, 2008
    Applicant: Shimano (Singapore) Pte., Ltd.
    Inventors: Wei Hock Kua, Aik Kwang Ng
  • Single wafer in-situ dry clean and seasoning for plasma etching process
    Patent number: 6274500
    Abstract: A new method is provided for the cleaning and seasoning of a Plasma Etch chamber. The wafer that is to be processed by the chamber is inserted into the chamber. The process of plasma clean is first performed on the Plasma Etch Chamber followed by a seasoning process of the Plasma Etch Chamber. The wafer is processed (etched) and removed from the chamber after the etch process has been completed. The cycle is then repeated starting with the step of loading the wafer into the plasma etch chamber followed by plasma clean and chamber seasoning of the plasma etch chamber.
    Type: Grant
    Filed: October 12, 1999
    Date of Patent: August 14, 2001
    Assignee: Chartered Semiconductor Manufacturing Ltd.
    Inventors: Dai Xuechun, Liang Chen, Aik Kwang Ng, Young Tsai