Abstract: A semiconductor wafer and a plurality of semiconductor dies are provided. The wafer and the dies each include first electrically conductive terminals arranged on a main surface. The wafer is permanently attached to each of the semiconductor dies such that the first terminals are electrically connected to one another. At least one of the wafer and the semiconductor dies is thinned. The wafer is diced so as to form a plurality of chip-stacks, each of the chip-stacks comprising one of the semiconductor dies permanently attached to a diced wafer chip. At least one of the first terminals in the chip-stack is accessible by a second electrically conductive terminal arranged on a rear surface and electrically connected to the first terminal by an electrical connector that is internal to a semiconductor body of either the semiconductor die or the diced wafer chip of the chip-stack.

Abstract: A semiconductor wafer and a plurality of semiconductor dies are provided. The wafer and the dies each include first electrically conductive terminals arranged on a main surface. The wafer is permanently attached to each of the semiconductor dies such that the first terminals are electrically connected to one another. At least one of the wafer and the semiconductor dies is thinned. The wafer is diced so as to form a plurality of chip-stacks, each of the chip-stacks comprising one of the semiconductor dies permanently attached to a diced wafer chip. At least one of the first terminals in the chip-stack is accessible by a second electrically conductive terminal arranged on a rear surface and electrically connected to the first terminal by an electrical connector that is internal to a semiconductor body of either the semiconductor die or the diced wafer chip of the chip-stack.