Patents by Inventor Ailing Ding

Ailing Ding has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • WAFER MANUFACTURING APPARATUS
    Publication number: 20260062795
    Abstract: In some implementations, a wafer holder apparatus includes a jig structure to receive a wafer, wherein the jig structure includes a first angled surface with respect to a nominal coating plane; and a spring structure to compress an end of the wafer against the first angled surface, wherein the spring structure includes: a spring; and a compression surface attached to the spring, wherein the compression surface includes a second angled surface matched to the first angled surface.
    Type: Application
    Filed: November 10, 2025
    Publication date: March 5, 2026
    Inventors: Ailing DING, Weibin HUANG, Yinxiang XIA, Markus K. TILSCH
  • Wafer manufacturing apparatus
    Patent number: 12467128
    Abstract: In some implementations, a wafer holder apparatus includes a jig structure to receive a wafer, wherein the jig structure includes a first angled surface with respect to a nominal coating plane; and a spring structure to compress an end of the wafer against the first angled surface, wherein the spring structure includes: a spring; and a compression surface attached to the spring, wherein the compression surface includes a second angled surface matched to the first angled surface.
    Type: Grant
    Filed: July 19, 2024
    Date of Patent: November 11, 2025
    Assignee: VIAVI SOLUTIONS SUZHOU CO., LTD.
    Inventors: Ailing Ding, Weibin Huang, Yinxiang Xia, Markus K. Tilsch